Inductive coupled filter with electrically neutral holes between solid spiral inductors

• US 5,696,471 A
• Filed: 11/20/1995
• Issued: 12/09/1997
• Est. Priority Date: 09/22/1995
• Status: Expired due to Fees

• Current Assignee: Uniden Corporation (Cornwall Capital Management LP)
• Original Assignee: Uniden Corporation (Cornwall Capital Management LP)
• Inventors: Fujiwara, Hideki
• Primary Examiner(s): Lee, Benny T.
• Assistant Examiner(s): Bettendorf, Justin P.
• Application Number:
  US08/560,684
• Time in Patent Office: 750 Days
• Field of Search: 333/167, 333/177-185, 336/200
• US Class Current: 333/177
• CPC Class Codes: H03H 7/09 Filters comprising mutual inductance
• CPC Class Codes: H03H 7/1725 Element to ground being common to different shunt paths, i.e. Y-structure
• CPC Class Codes: H03H 7/1758 Series LC in shunt or branch path H03H7/1791 takes precedence
• CPC Class Codes: H03H 7/1775 Parallel LC in shunt or branch path H03H7/1791 takes precedence

Abstract

A plurality of inductors are formed by connecting linear patterns formed in different surfaces of a substrate respectively by means of holes, forming a plurality of electrically neutral surfaces in areas not including the linear patterns on different surfaces of the substrate, and furthermore by forming electrically neutral holes connecting the electrically neutral surfaces to each other at positions between the plurality of inductors to affect the coupling between inductors.

Claims

1. A solid spiral inductor device comprising:

a plurality of inductors respectively including linear patterns each of the patterns being formed on different surfaces of a substrate and coupled by holes;

a plurality of electrically neutral surfaces each formed in areas not including said linear patterns respectively on different surfaces of said substrate; and

electrically neutral holes each located between respective ones of the plurality of said inductors and coupling respective ones of plurality of said electrically neutral surfaces to each other;

wherein by changing at least one of a spacing between respective ones of the plurality of said inductors, a number of said electrically neutral holes, and a cross sectional area of each of said electrically neutral holes, coupling between the plurality of said inductors is adjusted.

2. An inductive coupling filter comprising:

a solid spiral inductor which includes a plurality of inductors respectively having linear patterns each formed on different surfaces of a substrate and coupled by holes, a plurality of electrically neutral surfaces each formed in areas not including said linear patterns respectively on different surfaces of said substrate, and electrically neutral holes each located between respective ones of the plurality of said inductors and coupling respective ones of the plurality of said electrically neutral surfaces to each other;

an input terminal connected to one end of one of said inductors and for supplying thereto a specified power; and

an output terminal connected to one end of another one of said inductors and connected to any load;

wherein the other end of said one of said inductors and the other end of said another one of said inductors each are connected to said electrically neutral surfaces respectively;

wherein by changing at least one of spacing between respective ones of the plurality of said inductors, a number of said electrically neutral holes, and a cross sectional area of each of said electrically neutral holes, coupling between said plurality of inductors, between one end of the one of said inductors and said input terminal, and between one end of the another one of said inductors and said output terminal are adjusted.

3. A solid-state inductor device comprising:

a substrate having first and second surfaces;

a plurality of first strips formed in a first area of the substrate on the first surface;

a plurality of second strips formed in the first area of the substrate on the second surface between projections of the first strips, a plurality of first holes being provided in the substrate coupling the first strips and the second strips;

a plurality of third strips formed in a second area of the substrate on the first surface;

a plurality of fourth strips formed in the second area of the substrate on the second surface between projections of the third strips, a plurality of second holes being provided in the substrate coupling the third strips and the fourth strips;

a first electrically neutral region formed on the first surface so as to separate the first area from the second area; and

a second electrically neutral region formed on the second surface so as to separate the first area from the second area, a plurality of electrically neutral holes being provided in the substrate between the first electrically neutral region and the second electrically neutral region to adjust coupling capacity and mutual inductance between the strips in the first area and the strips in the second area.

4. The inductor device of claim 3, wherein AC current supplied to the strips in the first area generates magnetic flux in the substrate directed from the first area to the second area.

5. The inductor device of claim 3, further comprising:

a plurality of fifth strips formed in a third area of the substrate on the first surface;

a plurality of sixth strips formed in the third area of the substrate on the second surface between projections of the fifth strips, a plurality of third holes being provided in the substrate coupling the fifth strips and the sixth strips;

third and fourth electrically neutral regions respectively formed on the first and second surfaces so as to separate the third area from the second area.

6. The inductor device of claim 5, wherein Ac current supplied to the strips in the first area generates magnetic flux in the substrate directed from the first area to the second area, and from the second area to the third area.

7. The inductor device of claim 5, further comprising a first outside layer covering the first surface.

8. The inductor device of claim 7, further comprising a second outside layer covering the second surface.