Wafer processing apparatus

• US 5,697,749 A
• Filed: 04/11/1995
• Issued: 12/16/1997
• Est. Priority Date: 07/17/1992
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Kabushiki Kaisha (Tokyo Electron Limited), Tokyo Electron Tohoku Kabushiki Kaisha (Tokyo Electron Limited)
• Inventors: Takanabe, Eiichirou, Iwabuchi, Katsuhiko
• Primary Examiner(s): Werner, Frank E.
• Application Number:
  US08/420,610
• Time in Patent Office: 980 Days
• Field of Search: 414/217, 414/222, 414/416, 414/935, 414/936, 414/937, 414/939, 414/940, 414/941, 414/744.3, 204/298.25, 118/500, 118/719, 104/35, 104/49, 432/239
• US Class Current: 414/217
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

The present invention refers to a wafer transfer robot for a wafer boat of a wafer processing apparatus wherein a turntable within a chamber of a turntable apparatus is provided with a prescribed number of stations formed thereon. Each of the stations is provided with protrusions that hold a wafer cassette that is transferred thereto and orientated thereon in such a manner that a base surface thereof is inclined at an angle to the outward direction. Although, while the wafer cassette is being transferred and orientated, it is transferred and orientated reliably with the base surface thereof held horizontal by an elevator apparatus. By providing a loadlock chamber of a rotational configuration, the apparatus of the present invention ensures good sealing, and also ensures that when regions within the apparatus are being evacuated or being filled with an inert gas, they are kept reliably airtight. The generation of particles due to linear frictional movement is thus prevented, and the wafer processing can be performed extremely reliably and efficiently.

Claims

1. A wafer processing apparatus for transferring wafers from a wafer cassette to a wafer boat, said apparatus comprising:

means defining a wafer loading/unloading chamber adapted to receive a wafer boat,

a heat-treatment furnace,

a first elevator means for moving and supporting a wafer boat within said loading/unloading chamber, said first elevator means being mounted to a floor of said wafer loading/unloading chamber, for vertically moving the wafer boat into and out of said vertical heat treatment furnace,

means defining a transfer housing,

gate valve means connecting said loading/unloading chamber and said transfer housing, said gate valve means selectively airtightly isolating said loading/unloading chamber and said transfer housing, and

a wafer transfer apparatus located within said transfer housing, said wafer transfer apparatus including a transfer means for transferring wafers from a location in a wafer cassette to the wafer boat on said first elevator means, and a second elevator means for reciprocally vertically moving said transfer means with respect to the wafer boat, said reciprocal vertical movement of said second elevator means defining a stroke with respect to the boat that is equivalent to a height of the wafer cassette.

2. The wafer processing apparatus of claim 1, wherein said transfer means of said wafer transfer apparatus is a robot means having an arm capable of swiveling in a horizontal plane.

3. The wafer processing apparatus of claim 1,

wherein said apparatus further comprises a swivelable shutter located proximate to an opening of said vertical heat treatment furnace and swivel drive means for selectively driving said shutter to open and close said furnace opening, and

wherein said first elevator means has a lower position such that when said first elevator means is in such lower position, an uppermost portion of the wafer boat is spaced apart from said furnace opening and said shutter, below said opening and said shutter.