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System for real-time control of semiconductor wafer polishing

  • US 5,700,180 A
  • Filed: 10/24/1995
  • Issued: 12/23/1997
  • Est. Priority Date: 08/25/1993
  • Status: Expired due to Term
First Claim
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1. A system for polishing a semiconductor wafer, the system comprising:

  • a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head configured to support a semiconductor wafer relative to the platen subassembly under an adjustable polishing force to polish the wafer face;

    a controller selectively adjusting the polishing force during polishing of the wafer; and

    a plurality of pressure applicators supported by the polishing head and disposed to alter the contour of the wafer, the pressure applicators being individually controllable to move between retracted positions and extended positions to alter the contour of the wafer.

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