Heat dissipation device for an integrated circuit

• US 5,701,951 A
• Filed: 12/20/1994
• Issued: 12/30/1997
• Est. Priority Date: 12/20/1994
• Status: Expired due to Fees

• Current Assignee: Amigo Jean
• Original Assignee: Amigo Jean
• Inventors: Jean, Amigo
• Primary Examiner(s): Flanigan, Allen J.
• Application Number:
  US08/360,988
• Time in Patent Office: 1,106 Days
• Field of Search: 165/80.3, 165/185, 165/121, 174/16.3, 361/697, 361/710, 257/713, 257/722
• US Class Current: 165/121
• CPC Class Codes: F28F 2215/00 Fins
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device for an integrated circuit includes a heat-conducting base plate having a bottom surface which is adapted to contact the upper surface of the integrated circuit, and a corrugated porous heat dissipating plate made of a flexible heat conducting material and fixed on the upper surface of the base plate so as to transfer heat from the base plate to the heat dissipating plate for heat dissipation. The heat dissipating plate has a plurality of ventilation holes formed therethrough, which are located over the base plate so as to enhance currents of air in the spaces between the base plate and the heat dissipating plate. Accordingly, the heat dissipating area in a unit of the space occupied by the heat dissipating plate is large enough to offer a quick and effective heat dissipation. Preferably, the base plate is made of an insulating material so as to prevent electric conduction from the integrated circuit to the base plate in case that the insulating coating of the integrated circuit is broken.

Claims

1. A heat dissipation device for an integrated circuit, comprising:

a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated perforated heat dissipating plate made of a flexible heat conducting material and fixed on an upper surface of said base plate so as to transfer heat from said base plate to said perforated heat dissipating plate for heat dissipation;

said perforated heat dissipating plate having a plurality of ventilation holes formed therethrough, which are located over said base plate so as to enhance air flow in a space between said base plate and said perforated heat dissipating plate; and

said perforated heat dissipating plate further having imperforate parts intervening with said ventilating holes, said imperforate parts being greater in area than said ventilating holes.

2. A heat dissipation device for an integrated circuit, comprising a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated heat dissipating plate made of a sheet of imperforate heat conducting material and fixed on an upper surface of said base plate, said corrugated heat dissipating plate having a plurality of first bent portions in contact with said base plate, a plurality of second bent portions extending away from said base plate, regions between said first bent portions and second bent portions, and a plurality of ventilation holes formed in said corrugated heat dissipating plate within said second bent portions and said regions, said first bent portions being free of said ventilation holes.

3. A heat dissipation device as claimed in claim 2, wherein said base plate is made of an insulating material so as to prevent electric conduction from the integrated circuit to said base plate.

4. A heat dissipation device as claimed in claim 2, further comprising a fan unit which is attached to said base plate and which blows air to said perforated heat dissipating plate and into the space between said base plate and said perforated heat dissipating plate so as to form air current immediately over and under said perforated heat dissipating plate.