Methods for manufacturing a flow switch

• US 5,702,618 A
• Filed: 05/19/1995
• Issued: 12/30/1997
• Est. Priority Date: 10/04/1993
• Status: Expired due to Term

• Current Assignee: Research International Incorporated
• Original Assignee: Research International Incorporated
• Inventors: Saaski, Elric W., Lawrence, Dale M.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/444,075
• Time in Patent Office: 956 Days
• Field of Search: 216/2, 216/17, 216/33, 216/56, 216/97, 156/633.1, 156/644.1, 156/657.1, 156/659.11, 156/345, 437/228 H, 437/927
• US Class Current: 216/2
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2205/0294 Piezoelectric materials
• CPC Class Codes: A61M 5/14276 specially adapted for implantation
• CPC Class Codes: A61M 5/16881 Regulating valves on-off valves, e.g. clamps A61M39/28
• CPC Class Codes: B01D 61/18 Apparatus therefor
• CPC Class Codes: B01D 67/0058 by selective elimination of components, e.g. by leaching
• CPC Class Codes: B01D 67/0065 by anodic oxidation
• CPC Class Codes: B01D 69/02 characterised by their properties
• CPC Class Codes: B01D 71/02 Inorganic material
• CPC Class Codes: B01D 71/0213 Silicon
• CPC Class Codes: B01D 71/025 Aluminium oxide
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0076 using electrical discharge machining [EDM], milling or drilling
• CPC Class Codes: F16K 2099/0078 using moulding or stamping
• CPC Class Codes: F16K 2099/0088 Implanted devices
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0026 Valves using channel deformation
• CPC Class Codes: F16K 99/0034 : Operating means specially adapted for microvalves
• CPC Class Codes: F16K 99/0057 : the fluid being the circulating fluid itself, e.g. check valves
• CPC Class Codes: G05D 7/0694 : by action on throttling means or flow sources of very small size, e.g. microfluidics microvalves F16K99/0001; microstructural devices per se B81B
• CPC Class Codes: Y10S 366/03 : Micromixers: variable geometry from the pathway influences mixing/agitation of non-laminar fluid flow
• CPC Class Codes: Y10T 137/0491 : Valve or valve element assembling, disassembling, or replacing
• CPC Class Codes: Y10T 137/2607 : With pressure reducing inlet valve
• CPC Class Codes: Y10T 137/7788 : Pressures across fixed choke
• CPC Class Codes: Y10T 137/7791 : Pressures across flow line valve
• CPC Class Codes: Y10T 137/7792 : Movable deflector or choke
• CPC Class Codes: Y10T 29/49409 : Valve seat forming
• CPC Class Codes: Y10T 29/49412 : with assembly, disassembly or composite article making
• CPC Class Codes: Y10T 29/49417 : including molding or casting
• CPC Class Codes: Y10T 29/49419 : including machining or drilling
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

The fluid handling devices are capable of accurately handling substantially continuous fluid flow rates as low as about 0.01 cc/day. The devices are so miniaturized, corrosion-resistant and on-toxic that they are suitable for being implanted in the human body; and are capable of being mass produced at costs so low, by using micromachining techniques, such as etching, that they may be considered to be disposable. The devices are either passive devices which consume no electrical energy at all, or are active devices which consume very small amounts of electrical energy. The devices are reliable because they may have as few as only two parts, only one which is a moving part; and because they may handle fluids at very low pressures. The fluid handling devices include active piezoelectrically driven membrane pumps; and passive fluid flow regulators, on-off valves, flow switches and filters.

Claims

1. A method for manufacturing a flow switch, wherein said flow switch comprises:

a substrate, a membrane, and a switch gap;

wherein said substrate comprises a substrate mounting portion, an inlet switch seat, and outlet port means;

wherein said membrane comprises a membrane mounting portion, a resilient flexure which extends over at least a portion of said inlet switch seat, and an inlet port means, which is located over said inlet switch seat;

wherein said switch gap is located between said flexure and said switch seat;

wherein said inlet port means of said membrane are for receiving a fluid from a fluid source, and are for conveying said fluid through said membrane to said switch gap;

wherein said outlet port means of said substrate are for permitting said fluid to flow from said switch gap and out of said flow switch;

wherein, when a positive driving pressure difference of said fluid across said flow switch, which is less than a driving pressure difference switch point, is applied to a top surface of said flexure and to said inlet port means, said fluid flows into said flow switch through said inlet port means, flows radially outwardly across a top surface of said inlet switch seat through said switch gap; and

flows out of said flow switch through said outlet port means;

wherein, at said driving pressure difference switch point, said flexure automatically collapses against said inlet switch seat, to automatically close said switch gap, switch off said flow switch, and stop said fluid from flowing through said flow switch; and

wherein, at said positive driving pressure difference of said fluid across said flow switch which is less than said driving pressure difference switch point, said resilient flexure automatically moves away from said inlet switch seat, to automatically open said switch gap, switch said flow switch back on, and permit said fluid to flow through said flow switch once again; and

wherein said method comprises the steps of;

micromachining at least a portion of at least one of said inlet port means and said outlet port means, by etching said at least a portion of at least one of said inlet port means and said outlet port means into said membrane and said substrate, respectively; and

securing said membrane mounting portion and said substrate mounting portion together.

2. The method according to claim 1, wherein said inlet port means comprises an inlet port in said flexure;

and wherein said method further comprises the step of micromachining at least a portion of said inlet port into said flexure, by etching at least a portion of said inlet port into said flexure prior to performing said securing step.

3. The method according to claim 1, wherein said switch gap bas a switch gap height when there is a zero driving pressure difference of said fluid across said flow switch;

wherein at least a portion of said substrate mounting portion is higher than said top surface of said inlet switch seat, to produce a height difference between said top surface of said inlet switch seat and said at least a portion of said substrate mounting portion;

wherein said height difference is at least about equal to said switch gap height; and

wherein said method further comprises the step of micromachining at least a portion of said height difference, by etching away at least a portion of said top surface of said inlet switch seat prior to performing said securing step.

4. The method according to claim 1, wherein said outlet port means comprises an outlet cavity in said substrate;

and wherein said method further comprises the step of micromachining at least a portion of said outlet cavity into said substrate, by etching at least a portion of said outlet cavity into said substrate prior to performing said securing step.

5. The method according to claim 1, wherein said securing step comprises anodically bonding said substrate mounting portion and said membrane mounting portion together.

6. The method according to claim 1, wherein said method further comprises the steps of applying at least one layer of at least one corrosion-resistant material to a fluid-exposed portion of said flow switch;

and securing said at least one layer of at least one corrosion-resistant material to said fluid-exposed portion of said flow switch by using anodic bonding.

7. The method according to claim 6, wherein said step of securing said membrane mounting portion and said substrate mounting portion together, and said step of securing said at least one layer of at least one corrosion-resistant material to said fluid-exposed portion of said flow switch occur simultaneously, and both of said steps of securing comprise anodic bonding.

8. The method according to claim 1, wherein said outlet port means comprises an outlet port in said substrate;

wherein prior to performing said securing step, said method further comprises the step using a laser for drilling said outlet port into said substrate; and

wherein said laser, during said drilling, simultaneously forms at least a portion of said outlet port into a venturi-like shape.

9. The method according to claim 8, wherein said method further comprises the step of heating at least a portion of said substrate which is adjacent to said outlet port to about the anneal point of said substrate before performing said step of using said laser for drilling, to help prevent said substrate from cracking during said step of using said laser for drilling.

10. The method according to claim 1, wherein said method further comprises forming said membrane by the steps of providing a wafer of material having a backing layer which is etchable by a first etchant, and having a membrane layer which is not etchable by said first etchant, wherein said membrane layer has a thickness about equal to a desired final thickness of said membrane;

securing said membrane layer to said substrate during said step of securing said membrane mounting portion and said substrate mounting portion together; and

etching away at least a portion of said backing layer with said first etchant.

11. The method according to claim 10, wherein said inlet port means comprise an inlet port in said membrane;

wherein both said backing layer and said membrane layer are etchable by a second etchant; and

wherein said method further comprises micromachining said inlet port into said membrane by etching said inlet port into at least said wafer'"'"'s membrane layer with said second etchant, prior to performing said step of securing said membrane mounting portion and said substrate mounting portion together.