Micromachined peristaltic pump

• US 5,705,018 A
• Filed: 12/13/1995
• Issued: 01/06/1998
• Est. Priority Date: 12/13/1995
• Status: Expired due to Fees

• Current Assignee: Frank T. Hartley
• Original Assignee: Frank T. Hartley
• Inventors: Hartley, Frank T.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/572,186
• Time in Patent Office: 755 Days
• Field of Search: 156/345, 156/630.1, 156/657.1, 156/662.1, 216/2, 216/33, 216/41, 417/474, 417/477, 417/480
• US Class Current: 156/345.1
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F04B 43/12 having peristaltic action
• CPC Class Codes: F04B 43/14 having plate-like flexible members
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0084 Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 2099/0086 Medical applications
• CPC Class Codes: F16K 2099/0094 Micropumps
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0051 using electrostatic means
• CPC Class Codes: H02N 1/006 of the gap-closing type H02N1/004 takes precedence

Abstract

A micromachined pump including a channel formed in a semiconductor substrate by conventional processes such as chemical etching. A number of insulating barriers are established in the substrate parallel to one another and transverse to the channel. The barriers separate a series of electrically conductive strips. An overlying flexible conductive membrane is applied over the channel and conductive strips with an insulating layer separating the conductive strips from the conductive membrane. Application of a sequential voltage to the series of strips pulls the membrane into the channel portion of each successive strip to achieve a pumping action. A particularly desirable arrangement employs a micromachined push-pull dual channel cavity employing two substrates with a single membrane sandwiched between them.

Claims

1. A miniature pump structure comprising:

a substrate having a channel therein;

a series of conductive strips separated by insulative barriers formed in said channel, said strips and barriers lying transverse to said channel;

a flexible conductive membrane located over said channel; and

an insulative layer positioned over said conductive strips and between said strips and said membrane.

2. The pump structure of claim 1 wherein said channel has first and second sidewalls and a rounded bottom.

3. The pump structure of claim 1 wherein said substrate comprises a semiconductor substrate.

4. The pump structure of claim 2 wherein said membrane comprises a graphite impregnated polyurethane membrane.

5. The pump structure of claim 2 wherein said membrane comprises a polyurethane membrane having metallization applied to at least one surface thereof.

6. The pump structure of claim 1 wherein said membrane has an elasticity of 30%.

7. The pump structure of claim 1 further including means for applying a selected voltage to each of said strips in succession so as to create a peristaltic pumping action.

8. The pump structure of claim 1 wherein said membrane comprises a flexible polymer structure.

9. The microminiature pump structure comprising:

a substrate having a channel formed therein;

a flexible conductive membrane affixed on said substrate over said channel; and

means for attracting said membrane into said channel so as to contact a region of said channel and for causing the region of contact between said channel and said membrane to move down said channel so as to create a pumping action.

10. The pump structure of claim 9 wherein said channel further includes an inlet end and an output end, said inlet end being arranged to receive an ambient gas atmosphere and said outlet end being connected to supply ambient gas pumped from said atmosphere to a means for analyzing the chemical makeup of said gas atmosphere.

11. The pump structure of claim 10 wherein said means for analyzing is a gas spectrometer.

12. The pump structure of claim 9 wherein said substrate comprises a heated thermally conductive material and further including means for supplying a cooling fluid for circulation through said channel so as to effect convective coupling to the substrate, thereby enabling cooling of the substrate.

13. The pump structure of claim 9 further including a pneumatic turbine having a driving port connected to an output end of said channel and wherein said means for attracting further functions to pump air through said channel so as to drive said pneumatic turbine.

14. The pump structure of claim 9 wherein said channel has an inlet end connected to an output port of a vacuum chamber and wherein said means for attracting further functions so as to evacuate said vacuum chamber.

15. The structure of claim 9 further including means for connecting an inlet end of said channel to receive a liquid chemical input from a liquid chemical supply and means for connecting an outlet of said channel to a reaction chamber means, whereby said pump structure functions to transport said chemical to said reaction chamber.

16. The structure of claim 15 further including a second pump structure comprising a second substrate, a second flexible membrane, a second channel, and a second means for attracting said membrane into said second channel so as to contact a region of said second channel and for causing the region of contact between said second channel and said membrane to move down said second channel so as to allocate a second chemical to said reaction chamber.

17. The pump structure of claim 9 further including a thermal source and a thermal sink and wherein said channel is disposed such that said means for attracting circulates a fluid between an output of said thermal source and an input of said thermal sink.

18. The pump structure of claim 9 wherein said channel is connected to a source of refrigerant vapor and said means for attracting further operates to compress said vapor into its liquid phase.

19. The pump structure of claim 18 and further included in a means for creating a closed loop sterling cycle.

20. The pump structure of claim 9 including means for adapting said pump structure to provide tight thermal coupling between a cryogenic pump and an imaging objective.

21. The pump structure of claim 9 wherein said channel is circular and said means for attracting further operates so as to create a fluidic reaction wheel.

22. The pump structure of claim 9 and wherein said means for attracting is operated so as to selectively close and open a fluid path between an inlet to said channel and an output created in said substrate.

23. The pump structure of claim 9 wherein said means for attracting further generates a measure of flow rate through said channel.

24. A miniature pump comprising:

first and second substrates, having respective first and second channels formed therein and positioned to lie opposite one another when said first and second substrates are positioned adjacent one another;

a first array of conductive actuator elements located on said first substrate, each element traversing said first channel;

a second array of conductive actuator elements located on said second substrate, each element traversing said second channel;

respective first and second insulation layers formed over said first and second arrays of actuator elements;

a flexible electrically conductive membrane; and

means for connecting said substrates together such that the first and second channels lie opposite one another with said membrane sandwiched between said first and second insulation layers.

25. The pump of claim 24 wherein said means for connecting comprises;

first and second bond metal trenches lying parallel, respectively, to said first and second channels; and

bond metal means in said first and second trenches for forming a hermetic seal between an insulation layer and a substrate surface.

26. The pump of claim 25 further including a respective conductor channel means in each substrate for establishing electrical connection to said membrane.