Method for forming trench transistor structure
First Claim
1. A method for forming a semiconductor device, the method comprising:
- providing a substrate;
forming a trench region within the substrate, the trench region having an annular-shaped sidewall;
forming a P-doped channel region adjacent a first portion of the annular-shaped sidewall;
forming an N-doped channel region adjacent a second portion of the annular-shaped sidewall, wherein the first portion and the second portion are physically different regions; and
forming a gate electrode adjacent the annular-shaped sidewall to control current flow in both the N-doped channel region and the P-doped channel region.
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Accused Products
Abstract
A method for forming a trench transistor structure begins by forming a buried layers (12 and 16) and a doped well (22) in a substrate (10) via epitaxial growth processing. A trench region (24) is then etched into the substrate (10) to expose a the layer (12). A conductive sidewall spacer (28) is formed within the trench (24) as a gate electrode. The spacer (28) gates a first transistor (12, 28, 32) located adjacent a first half of the trench (24) and a second transistor (12, 28, 34) located adjacent a second half of the trench (24). Region (12) is a common electrode wherein the channel regions of both the first and second transistor are coupled in a serial manner through the region (12).
172 Citations
48 Claims
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1. A method for forming a semiconductor device, the method comprising:
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providing a substrate; forming a trench region within the substrate, the trench region having an annular-shaped sidewall; forming a P-doped channel region adjacent a first portion of the annular-shaped sidewall; forming an N-doped channel region adjacent a second portion of the annular-shaped sidewall, wherein the first portion and the second portion are physically different regions; and forming a gate electrode adjacent the annular-shaped sidewall to control current flow in both the N-doped channel region and the P-doped channel region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for forming a semiconductor device, the method comprising:
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providing a substrate; forming a first doped buried region of a first conductivity type within the substrate; forming a second doped buried region adjacent the first doped buried region, the second doped buried region being of a second conductivity type; forming a semiconductor region over the second doped buried region; doping the semiconductor region such that;
(1) a first portion of the semiconductor region is doped having the first conductivity type wherein the first portion of the semiconductor region overlies a portion of the second doped buried region; and
(2) a second portion of the semiconductor region is doped having the second conductivity type wherein the second portion of the semiconductor region overlies a portion of the first doped buried region, the first portion of the semiconductor region being in close proximity to the second portion of the semiconductor region to form an interface region therebetween;forming a trench region having a sidewall and a bottom surface, the trench region being formed through the interface region to expose the first portion of the semiconductor region with a first portion of the sidewall of the trench region, expose the second portion of the semiconductor region with a second portion of the sidewall of the trench region, and expose the first doped buried region with the bottom surface of the trench region; forming an oxide over the trench sidewall and bottom surface; depositing a conductive layer of material; etching the conductive layer of material to form a gate sidewall spacer adjacent the sidewall; forming a first doped region of the second conductivity type above the first portion of the semiconductor region; and forming a second doped region of the first conductivity type overlying the first portion of the semiconductor region, wherein the gate sidewall spacer controls current flow through the first portion of the semiconductor region adjacent the sidewall of the trench region and the second portion of the substrate adjacent the sidewall of the trench region. - View Dependent Claims (19, 20, 21, 22, 23)
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24. A method for forming a semiconductor device, the method comprising the steps of:
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providing a substrate having a surface; forming a doping barrier layer overlying the substrate, the doping barrier layer having an opening which exposes a portion of the substrate to define a first exposed substrate portion, a second exposed substrate portion, and a third exposed substrate portion wherein the first and third exposed substrate portions of the substrate are separated by the second exposed substrate portion; forming a trench region within the second exposed substrate portion, the trench region being used to form at least one vertical transistor device; doping the first exposed substrate portion with N-type dopant atoms; and doping the second exposed substrate portion with P-type dopant atoms. - View Dependent Claims (25, 26, 27)
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28. A method for forming a semiconductor device, the method comprising the steps of:
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providing a substrate having a top surface; forming a trench region within the substrate having a sidewall and a bottom portion, the sidewall having a first half and a second half; forming a first conductive region at the bottom portion of the trench region and within the substrate; forming a second conductive region adjacent the first half of the sidewall and adjacent a top surface of the substrate; forming a third conductive region adjacent the second half of the sidewall and adjacent a top surface of the substrate, the second and third conductive regions being physically separated from one another by the trench region; forming a first conductive sidewall spacer within the trench having a first height laterally adjacent first half of the sidewall and a second height laterally adjacent the second half of the sidewall wherein the first height is greater than the second height; and forming a second conductive sidewall spacer within the trench region and adjacent the first conductive sidewall spacer. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A method for forming a semiconductor device, the method comprising the steps of:
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providing a substrate having a top surface, the substrate having a first area, a second area, and a third area wherein the first area is laterally adjacent the second area and the second area is laterally adjacent the third area; forming a first N-channel transistor within the first area of the substrate wherein the first N-channel transistor has a channel region wherein current flows substantially vertically through the channel region; forming a second N-channel transistor within the third area of the substrate wherein the second N-channel transistor has a channel region wherein current flows substantially vertically through the channel region; forming a P-channel transistor within the second area of the substrate wherein the P-channel transistor has a channel region wherein current flows substantially vertically through the channel region; and wherein the P-channel transistor, the first N-channel transistor, and the second N-channel transistor all connect to a common node formed within the substrate.
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39. A method for forming a semiconductor device, the method comprising the steps of:
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forming a first N-type region of substrate material; forming a first P-type region overlying the first N-type region wherein the first P-type region abuts the first N-type region and is made of the substrate material; forming a second N-type region overlying the first P-type region wherein the second N-type region abuts the first P-type region and is made of the substrate material; forming a second P-type region overlying the second N-type region wherein the second P-type region abuts the first N-type region and is made of the substrate material; forming a dielectric layer overlying the second P-type region; etching an opening through the dielectric layer, the first and second P-type regions, and the second N-type region to expose a portion of the first N-type region, the opening having a sidewall; forming a sidewall dielectric layer laterally adjacent the sidewall of the opening; and forming a conductive layer within the opening which connects to the first N-type region. - View Dependent Claims (40, 41, 42)
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43. A method for forming a semiconductor device, the method comprising the steps of:
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forming a first P-type region of substrate material; forming a first N-type region above the first P-type region wherein the first N-type region abuts the first P-type region and is made of the substrate material; forming a second P-type region above the first N-type region wherein the second P-type region abuts the first N-type region and is made of the substrate material; forming a second N-type region above the second P-type region wherein the second N-type region abuts the first P-type region and is made of the substrate material; forming a dielectric layer above the second N-type region; etching an opening through the dielectric layer, the first and second N-type regions, and the second P-type region to expose a portion of the first P-type region, the opening having a sidewall; forming a sidewall dielectric layer laterally adjacent the sidewall of the opening; and forming a conductive layer within the opening which connects to the first P-type region.
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44. A method for forming a semiconductor device, the method comprising the steps of:
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forming a first doped region within a substrate; forming a second doped region above the first doped region wherein the second doped region abuts the first doped region and is made of the substrate material, the second doped region being of a first conductivity type; forming a third doped region above the second doped region wherein the third doped region abuts the second doped region and is made of substrate material, the second doped region being of a second conductivity type different from the first conductivity type; forming a dielectric layer above the third doped region; etching an opening through the dielectric layer, the second doped region and the third doped region to expose a portion of the first doped region, the opening having a sidewall; forming a sidewall dielectric layer laterally adjacent the sidewall of the opening; and forming a conductive layer within the opening which connects to the first doped region. - View Dependent Claims (45, 46)
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47. A method for forming a transistor structure comprising the steps of:
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providing a substrate; forming a trench region within the substrate, the trench region having a top portion, a bottom portion, a sidewall, a first half and a second half; forming a first doped current electrode at a bottom portion of the trench region; forming a second doped current electrode at a top portion of the trench region, a channel region being defined between the first and second doped current electrodes and adjacent the first half of the trench region; forming an annular conductive sidewall conductor within the trench region wherein the second annular conductive sidewall conductor controls a current flow through the channel region; and reducing a height of the annular conductive sidewall conductor so that a height of the annular conductive sidewall conductor adjacent the first half of the trench region is greater than a height of the annular conductive sidewall conductor adjacent the second half of the trench region. - View Dependent Claims (48)
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Specification