Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same

• US 5,705,855 A
• Filed: 09/06/1996
• Issued: 01/06/1998
• Est. Priority Date: 01/13/1995
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Reckleben, Lisa, Zhong, Dawn He, Joslin, Scott Lawrence, Hogrefe, Arnold William Jr., Carson, Robert Thomas
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/709,421
• Time in Patent Office: 487 Days
• Field of Search: 257/737, 257/738, 257/773, 257/778, 257/780, 257/692, 361/760, 361/772, 361/773, 361/779, 361/783
• US Class Current: 257/737
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01011 Sodium [Na]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).

Claims

1. An integrated circuit (IC) which attaches to a glass substrate, which includes an integrated circuit die comprising circuitry, and which includes cavities formed in a first surface thereof, the IC comprising:

metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry;

conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass; and

an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate,

wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.

2. The IC of claim 1, wherein the material from which the conductive bumps are formed comprises indium.

3. The IC of claim 1, wherein the material from which the conductive bumps are formed comprises an indium alloy.

4. The IC of claim 1, wherein the material from which the conductive bumps are formed liquefies in a temperature range of 145°

centigrade to 180°

centigrade.

5. An electronic device for displaying information to a user, the electronic device comprising:

a display for presenting the information, the display including a glass substrate having conductive runners formed thereon;

an integrated circuit (IC) for attaching to the glass substrate, the IC having cavities formed in a first surface thereof and including an integrated circuit die having circuitry included thereon, the IC comprising;

metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry;

conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass such that the conductive bumps electrically couple the circuitry to the conductive runners of the glass substrate when heat is applied thereto; and

an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate,

wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.

6. The electronic device of claim 5, wherein the material from which the conductive bumps are formed comprises indium.

7. The electronic device of claim 5, wherein the material from which the conductive bumps are formed comprises an indium alloy.

8. The electronic device of claim 5, wherein the material from which the conductive bumps are formed liquefies in a temperature range of 145°

centigrade to 180°

centigrade.

9. The electronic device of claim 5, wherein the IC comprises a display driver for providing display signals to the display to generate presentation of the information.

10. The electronic device of claim 5, further comprising:

a printed circuit board on which device circuitry is mounted for performing operations of the electronic device, the printed circuit board including conductive pads formed thereon; and

a connector coupled between the conductive pads of the printed circuit board and the conductive runners formed on the glass substrate for providing electrical signals from the device circuitry to the circuitry of the IC.

11. The electronic device of claim 10, wherein:

the device circuitry includes a receiver for receiving a radio signal and a decoder for recovering a message from the radio signal; and

the IC includes a display driver for providing display signals to the display to generate presentation of the information in accordance with the message decoded by the device circuitry.