Method for designing ultrasonic transducers using constraints on feasibility and transitional Butterworth-Thompson spectrum

• US 5,706,564 A
• Filed: 09/30/1996
• Issued: 01/13/1998
• Est. Priority Date: 07/27/1995
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Rhyne, Theodore Lauer
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US08/724,093
• Time in Patent Office: 470 Days
• Field of Search: 310/311, 310/326, 310/327, 310/334-336, 29/25.35
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/0677 and a high impedance backing
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method for designing ultrasonic transducers used in diagnostic ultrasonic imagers, in particular, transducers made up of at least one piezoelectric layer and at least one acoustic matching layer, plus various bonding and backing layers. The method of transducer design uses a particular family of spectra as the basis of the bandpass characteristic. The approach is to specify a transfer function from the Transitional Butterworth Thompson family of spectra. The specification is influenced by trade-offs in bandwidth, transient response and design feasibility. This family is indexed by a design parameter called M. Using the M factor, a designer can more readily make the engineering trade-offs needed. By adjusting this parameter, any dynamic response from maximally flat to Gaussian can be obtained. Since not all possible members of this spectral family are feasible as transducers, a design space (bandwidth versus band shape) is used to systematically represent the engineering trade-offs and to graphically represent the physical constraints on feasibility.

Claims

1. A method for manufacturing an ultrasonic transducer having:

a layer of backing material;

a layer of piezoelectric material acoustically coupled to said layer of backing material;

a layer of first acoustic matching material acoustically coupled to said layer of piezoelectric material; and

a layer of second acoustic matching material acoustically coupled to said layer of first acoustic matching material,

said method comprising the steps of;

creating a design space having first and second axes, said first axis having a dimension of fractional bandwidth and said second axis having a dimension of band shape;

synthesizing a plurality of transducer designs for a corresponding plurality of points in said design space using the fractional bandwidth and band shape values for each point;

plotting goodness-of-fit error values for each of said plurality of points;

drawing a contour representing points having a predetermined error level such that design points on one side of said contour have an unacceptable error and design points on the other side of said contour have an acceptable error;

selecting a target transfer function corresponding to a design point on said other side of said contour; and

adjusting the properties of said layers of said ultrasonic transducer to achieve said target transfer function by minimizing the error of fit, wherein said adjusting step comprises the steps of selecting a first impedance and a first thickness of said layer of first acoustic matching material, a second impedance and a second thickness of said second acoustic matching material, and a third thickness of said layer of piezoelectric material so that the transfer function of said transducer is a Transitional Butterworth-Thompson transfer function;

forming said layer of first acoustic matching material having said first impedance and said first thickness;

forming said layer of second acoustic matching material having said second impedance and said second thickness;

forming said layer of piezoelectric material having said third thickness;

bonding said layer of first acoustic matching material to a front face of said piezoelectric layer;

bonding said layer of second acoustic matching material to said layer of first acoustic matching material; and

bonding said layer of backing material to a rear face of said piezoelectric layer.

2. The method as defined in claim 1, wherein said adjusting step is performed by computer optimization.

3. The method as defined in claim 2, wherein said computer optimization utilizes a steepest descent gradient search algorithm.

4. The method as defined in claim 1, wherein the scale of said band shape dimension is a parameter M which varies from zero for a Butterworth transfer function to unity for a Bessel transfer function.