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Test structure and method for performing burn-in testing of a semiconductor product wafer

  • US 5,707,881 A
  • Filed: 09/03/1996
  • Issued: 01/13/1998
  • Est. Priority Date: 09/03/1996
  • Status: Expired due to Term
First Claim
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1. A method for manufacturing a test structure, the method comprising the steps of:

  • providing a base layer having exposed conductive connection regions;

    providing a plurality of segmented integrated circuits wherein the segmented integrated circuits have exposed conductive connection regions;

    coupling the plurality of segmented integrated circuits to the base layer wherein the exposed conductive connection regions of the plurality of segmented integrated circuits are electrically coupled to the exposed conductive connection regions of the base layer;

    forming a stabilizing layer which mechanically strengthens the plurality of segmented integrated circuits which are coupled to the base layer, wherein the stabilizing layer, plurality of segmented integrated circuits, and base layer now form the test structure; and

    using the test structure to stimulate at least one integrated circuit.

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