Voltage controller for electrostatic chuck of vacuum plasma processors

• US 5,708,250 A
• Filed: 03/29/1996
• Issued: 01/13/1998
• Est. Priority Date: 03/29/1996
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Jafarian-Tehrani, Seyed Jafar, Benjamin, Neil, Artusy, Max
• Primary Examiner(s): Paschall, Mark H.
• Application Number:
  US08/623,774
• Time in Patent Office: 655 Days
• Field of Search: 219/121.43, 219/121.58, 219/121.54, 361/233, 361/234, 156/345, 156/646.1, 315/111.31, 315/111.41, 269/903
• US Class Current: 219/121.58
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems

Abstract

An r.f. excited vacuum plasma processor has a workpiece held in place by a monopolar or bipolar electrostatic chuck having an electrode that develops peak r.f. voltages over a wide amplitude range. A chuck DC power supply source is connected to the chuck. An r.f. peak detecting circuit coupled with the electrode is part of a circuit for controlling the DC voltage applied by the chuck power supply to the chuck. The control circuit supplies an unamplified replica of a DC voltage derived by the peak detecting circuit to the chuck DC power supply source via a DC circuit including only passive elements so the level of the DC voltage applied to the chuck varies in response to variations in the peak amplitude of the r.f. voltage. The peak detector includes at least several series connected diodes having electrodes polarized in the same direction or two stacks of series connected diodes. In one of the stacks, the diode electrodes are polarized in one direction and in the other stack the diode electrodes are polarized in the other direction. The diodes of the peak detecting circuit are arranged so the DC bias voltage supplied to the chuck and the peak value of the r.f. voltage developed at the electrode have the same order of magnitude.

Claims

1. An r.f. excited vacuum plasma processor for processing a workpiece, comprising an electrostatic chuck having at least one electrode for holding the workpiece in place, an r.f. bias source connected to the chuck so the at least one electrode develops peak r.f. voltages over a wide amplitude range, a chuck DC power supply source connected to the chuck, an r.f. peak detecting circuit coupled with said at least one electrode, the peak detecting circuit being included in a circuit for controlling the DC voltage applied by the chuck DC power supply source to the chuck, the r.f. peak detecting circuit deriving a DC voltage having an amplitude approximately proportional to and on the same order of magnitude as the peak r.f. voltage of said at least one electrode, the control circuit supplying an unamplified replica of the DC voltage derived by the peak detecting circuit to the chuck DC power supply source so the level of the DC voltage applied by the chuck DC power supply source to the chuck varies in response to variations in the amplitude of the replica of the DC voltage derived by the peak detecting circuit, the DC voltage supplied by the chuck DC power supply source to the chuck and the peak value of the r.f. voltage developed at the electrode having the same order of magnitude.

2. The processor of claim 1 wherein the peak detector includes at least several series connected diodes having electrodes polarized in the same direction.

3. The processor of claim 2 wherein said several series connected diodes having electrodes polarized in the same direction are connected in a stack between an input terminal of the peak detector and ground and are shunted by a low pass filter coupled to one terminal of said chuck DC power supply source.

4. The processor of claim 3 wherein the peak detecting circuit includes only one of said stacks.

5. The processor of claim 3 wherein the peak detecting circuit includes two of said stacks, the diodes of one of said stacks being polarized in a first direction, the diodes of the other of said stacks being polarized in a second direction.

6. The processor of claim 1 wherein the electrostatic chuck is a monopolar chuck having only one electrode, said one electrode being connected to one terminal of said chuck DC power supply source, another terminal of said chuck DC power supply source being DC connected to a terminal where the unamplified replica of the DC voltage is derived.

7. The processor of claim 1 wherein the electrostatic chuck is a bipolar chuck having opposite polarity first and second electrodes, the chuck DC power supply source having a floating terminal having a potential between the potentials of first and second opposite polarity DC terminals respectively connected to the first and second electrodes, the floating terminal being connected by a DC path to a terminal where the replica of the DC voltage derived by the peak detecting circuit is derived.

8. The processor of claim 1 wherein the control circuit includes a DC connection having only passive elements between the peak detecting circuit and the chuck DC power supply source.

9. An r.f. excited vacuum plasma processor for processing a workpiece, comprising an electrostatic chuck having at least one electrode for holding the workpiece in place, an r.f. bias source connected to the chuck so the at least one electrode develops peak r.f. voltages over a wide amplitude range, a chuck DC power supply source connected to the chuck, an r.f. peak detecting circuit coupled with said at least one electrode, the peak detecting circuit being included in a circuit for controlling the DC voltage applied by the chuck DC power supply source to the chuck, the r.f. peak detecting circuit deriving a DC voltage having an amplitude approximately proportional to and on the same order of magnitude as the peak r.f. voltage of said at least one electrode, the control circuit including a DC connection having only passive elements between the peak detecting circuit and the chuck DC power supply source so the level of the DC voltages applied by the chuck DC power supply to the chuck varies in response to variations in the amplitude of the DC voltage derived by the peak detecting circuit, the DC voltage supplied by the chuck DC power supply to the chuck and the peak value of the r.f. voltage developed at the electrode having the same order of magnitude.

10. The processor of claim 9 wherein the peak detector includes at least several series connected diodes having electrodes polarized in the same direction.

11. The processor of claim 10 wherein said several series connected diodes having electrodes polarized in the same direction are connected in a stack between an input terminal of the peak detector and ground and are shunted by a low pass filter coupled to one terminal of said chuck DC power supply source.

12. The processor of claim 11 wherein the peak detecting circuit includes only one of said stacks.

13. The processor of claim 11 wherein the peak detecting circuit includes two of said stacks, the diodes of one of said stacks being polarized in a first direction, the diodes of the other of said stacks being polarized in a second direction.

14. The processor of claim 9 wherein the electrostatic chuck is a monopolar chuck having only one electrode, said one electrode being connected to one terminal of said chuck DC power supply source, another terminal of said chuck DC power supply source being DC connected to a terminal where the unamplified replica of the DC voltage is derived.

15. The processor of claim 9 wherein the electrostatic chuck is a bipolar chuck having opposite polarity first and second electrodes, the chuck DC power supply source having a floating terminal having a potential between the potentials of first and second opposite polarity DC terminals respectively connected to the first and second electrodes, the floating terminal being connected by a DC path to a terminal where the replica of the DC voltage derived by the peak detecting circuit is derived.

16. An r.f. excited vacuum plasma processor for processing a workpiece, comprising an electrostatic chuck having at least one electrode for holding the workpiece in place, an r.f. bias source connected to the chuck so the at least one electrode develops peak r.f. voltages over a wide amplitude range, a chuck DC power supply source connected to the chuck, an r.f. peak detecting circuit coupled with said at least one electrode, the peak detecting circuit being included in a circuit for controlling the DC bias applied by the chuck DC power supply source to the chuck, the r.f. peak detecting circuit including at least several series connected diodes having electrodes polarized in the same direction and deriving a DC voltage having an amplitude approximately proportional to the peak r.f. voltage of said at least one electrode, the control circuit supplying a replica of the DC voltage derived by the peak detecting circuit to the chuck DC power supply source so the level of the DC voltage applied by the chuck power supply source to the chuck varies in response to variations in the amplitude of the replica of the DC voltage derived by the peak detecting circuit, the diodes of the peak detecting circuit being arranged so the DC voltage supplied by the chuck power supply source to the chuck and the peak value of the r.f. voltage developed at the electrode have the same order of magnitude.

17. The processor of claim 16 wherein said several series connected diodes having electrodes polarized in the same direction are connected in a stack between an input terminal of the peak detector and ground and are shunted by a low pass filter coupled to one terminal of said chuck DC power supply source.

18. The processor of claim 17 wherein the peak detecting circuit includes only one of said stacks.

19. The processor of claim 17 wherein the peak detecting circuit includes two of said stacks, the diodes of one of said stacks being polarized in a first direction, the diodes of the other of said stacks being polarized in a second direction.

20. The processor of claim 16 wherein the electrostatic chuck is a monopolar chuck having only one electrode, said one electrode being connected to one terminal of said chuck DC power supply source, another terminal of said chuck DC power supply source being DC connected to a terminal where the unamplified replica of the DC voltage is derived.

21. The processor of claim 16 wherein the electrostatic chuck is a bipolar chuck having opposite polarity first and second electrodes, the chuck DC power supply source having a floating terminal having a potential between the potentials of first and second opposite polarity DC terminals respectively connected to the first and second electrodes, the floating terminal being connected by a DC path to a terminal where the replica of the DC voltage derived by the peak detecting circuit is derived.