Method of wire bonding an integrated circuit to an ultraflexible substrate
First Claim
1. A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate comprising the steps of:
- (a) providing a flexible dielectric substrate having an IC attachment area located on one of a first principal surface and a second, opposite principal surface of the substrate and at least one resonant circuit comprising a first conductive pattern disposed on the first principal surface and a second conductive pattern disposed on the second principal surface, wherein the first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, wherein the inductor functions as an antenna;
(b) cleaning an IC bond attach area of the substrate, the IC bond attach area comprising an area of the substrate and the resonant circuit proximate to and including the IC attachment area;
(c) securing the flexible substrate in a fixed position to prevent substantial movement of the substrate;
(d) securing the IC to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate;
(e) wire bonding the IC to the resonant circuit, thereby electrically connecting the IC to the resonant circuit with at least one wire bond; and
(f) applying a protective covering over the at least one wire bond to protect the at least one wire bond from being damaged by external forces.
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Accused Products
Abstract
A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate. A flexible dielectric substrate has an IC attachment area and at least one resonant circuit formed thereon. The resonant circuit is formed with a first conductive pattern disposed on a first principal surface of the flexible substrate and a second conductive pattern disposed on a second, opposite principle surface of the flexible substrate. The first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, with the inductor also functioning as an antenna. The IC attachment area of the flexible substrate is cleaned and the flexible substrate is secured in a fixed position in a plenum to prevent substantial movement thereof. The IC is secured to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate. Wire bonding of the IC to at least one electrical conductor of the resonant circuit is performed to electrically connect the IC to the at least one electrical conductor. A protective covering is applied over the IC and the wire bond to protect the wire bond from being damaged by external forces.
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Citations
21 Claims
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1. A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate comprising the steps of:
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(a) providing a flexible dielectric substrate having an IC attachment area located on one of a first principal surface and a second, opposite principal surface of the substrate and at least one resonant circuit comprising a first conductive pattern disposed on the first principal surface and a second conductive pattern disposed on the second principal surface, wherein the first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, wherein the inductor functions as an antenna; (b) cleaning an IC bond attach area of the substrate, the IC bond attach area comprising an area of the substrate and the resonant circuit proximate to and including the IC attachment area; (c) securing the flexible substrate in a fixed position to prevent substantial movement of the substrate; (d) securing the IC to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate; (e) wire bonding the IC to the resonant circuit, thereby electrically connecting the IC to the resonant circuit with at least one wire bond; and (f) applying a protective covering over the at least one wire bond to protect the at least one wire bond from being damaged by external forces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A radio frequency identification (RFID) tag for use with a communication system having means for detecting the presence of an RFID tag within a surveilled area utilizing electromagnetic energy at a frequency within a predetermined frequency range and means for receiving digitally encoded information transmitted from the RFID tag, the RFID tag comprising:
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a flexible dielectric substrate; at least one resonant circuit comprising a first conductive pattern disposed on a first principal surface of the flexible substrate and a second conductive pattern disposed on a second, opposite principle surface of the flexible substrate, wherein the first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, wherein the inductor functions as an antenna; an IC attachment area on one of the first and second principal surfaces of the substrate; an integrated circuit (IC) attached to the IC attachment area and electrically connected to the resonant circuit, the IC storing digitally encoded information, wherein detection by the antenna of a signal at a predetermined frequency causes the antenna to provide power to the IC such that the digitally encoded information is output therefrom and transmitted by the antenna at a predetermined frequency range; and an encapsulant covering the IC and the electrical connections between the IC and the resonant circuit. - View Dependent Claims (18, 19, 20, 21)
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Specification