Solder bonded electronic module
First Claim
1. An electronic module comprising:
- a circuit substrate having a thermal via disposed therethrough;
a heat-generating electronic component overlying an upper surface of the thermal via;
a metal baseplate;
an electrically insulating layer overlying the metal baseplate;
a thermal attachment pad overlying the electrically insulating layer; and
a solder layer overlying the thermal attachment pad, wherein the solder layer thermally couples the thermal via to the thermal attachment pad and attaches the circuit substrate to the metal plate.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic control module (10) includes a circuit substrate (12) containing a plurality of thermal vias (36) and a heat-generating electronic device (26) attached to the thermal vias (36). The circuit substrate (12) is attached to a mounting plate (18) by a plurality of electrically-isolated, thermal attachment pads (20) located at selected positions on an electrically insulating layer (16) overlying a metal baseplate (14). A solder layer (22) functions to both mechanically attach the plurality of thermal vias (36) to the plurality of thermal attachment pads (20), and to provide a thermal dissipation pathway for heat generated by the electronic devices (26). The heat is transferred from the circuit substrate (12) through the plurality of thermal attachment pads (20) to the metal baseplate (14).
170 Citations
11 Claims
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1. An electronic module comprising:
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a circuit substrate having a thermal via disposed therethrough; a heat-generating electronic component overlying an upper surface of the thermal via; a metal baseplate; an electrically insulating layer overlying the metal baseplate; a thermal attachment pad overlying the electrically insulating layer; and a solder layer overlying the thermal attachment pad, wherein the solder layer thermally couples the thermal via to the thermal attachment pad and attaches the circuit substrate to the metal plate. - View Dependent Claims (2, 3, 4)
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5. An electronic module comprising:
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a printed circuit board populated with a plurality of heat-generating electronic components, wherein each heat-generating electronic component overlies a plurality of thermal vias extending through the printed circuit board; a mounting plate including a metal baseplate having an electrically insulating layer thereon; and a plurality of thermal attachment pads at selected locations on the electrically insulating layer thermally coupling the plurality of heat-generating electronic components to the mounting plate, wherein each of the plurality of thermal attachment pads is bonded to the plurality of thermal vias by a solder layer, and wherein the plurality of thermal attachment pads attach the printed circuit board to the mounting plate. - View Dependent Claims (6, 7)
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8. An electronic module comprising:
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a multi-layer printed circuit board having a device surface opposite a mounting surface; a plated via extending through the multi-layer printed circuit board from the device surface to the mounting surface; a heat-generating electronic component attached to the plated via; an aluminum mounting plate having a thermally conductive, electrically insulating material thereon; a solderable metal layer overlying the thermally conductive, electrically insulating material; and a solder layer overlying the solderable metal layer, wherein the solder layer thermally couples the plated via to the copper layer, and wherein the solder layer attaches the multi-layer printed circuit board to the aluminum mounting plate. - View Dependent Claims (9, 10, 11)
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Specification