Apparatus and method for automatic monitoring and control of stencil printing

• US 5,709,905 A
• Filed: 01/28/1997
• Issued: 01/20/1998
• Est. Priority Date: 01/28/1997
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Adams, Dale R., Shaw, Michael F., Suppelsa, Anthony J.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): PARKER, FREDERICK JOHN
• Application Number:
  US08/789,252
• Time in Patent Office: 357 Days
• Field of Search: 427/8, 427/282, 427/96, 118/406, 118/413, 118/504, 118/669, 101/129, 101/484, 364/468.26, 901/47, 222/163, 222/537
• US Class Current: 427/8
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/1233 Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Abstract

A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.

Claims

1. A stencil printing apparatus for printing a viscous material onto a receiving substrate through apertures in a first surface of a stencil using a squeegee, while a second surface of the stencil parallel to the first surface is in contact with a receiving surface of the substrate, comprising:

a laser surface profiling device attached to said stencil printing apparatus such that a laser beam emitted from said laser surface profiling device is directed toward a portion of the viscous material disposed upon said first surface of the stencil, said laser profiling device movable parallel to said first surface of the stencil; and

a controller coupled to said laser surface profiling device, said controller for receiving and interpreting topographical data communicated from said laser surface profiling device for said portion of said viscous material, and said controller providing feedback to a viscous material dispenser coupled to said controller in response to said topographical data.

2. The stencil printing apparatus of claim 1, in which said viscous material dispenser provides means for adding viscous material to said first surface of the stencil, and said viscous material dispenser adding viscous material to said first surface of the stencil in response to information from said controller.

3. The stencil printing apparatus of claim 1, wherein said viscous material dispenser comprises a pneumatic dispenser.

4. A stencil printing apparatus for printing a solder paste onto metallized portions of a printed circuit substrate through apertures on a first surface of a stencil using a squeegee, while a second surface of the stencil parallel to the first surface is in contact with a receiving surface of the substrate, comprising:

a laser surface profiling device attached to said stencil printing apparatus such that a laser beam emitted from said laser surface profiling device is directed toward a portion of the solder paste disposed upon said first surface of the stencil, said laser profiling device movable parallel to said first surface of the stencil;

a solder paste dispenser movable both parallel to, and normal to, the first surface of the stencil, said solder paste dispenser for adding solder paste to the first surface of the stencil; and

a controller coupled to both said laser surface profiling device and said solder paste dispenser for receiving and interpreting topographical data communicated from said laser surface profiling device from said portion of the solder paste disposed upon said first surface of the stencil, and said controller providing feedback to said solder paste dispenser in response to said topographical data.

5. The stencil printing apparatus of claim 4, wherein said solder paste dispenser comprises a pneumatic dispenser.

6. A method of printing a viscous material onto a receiving substrate wherein the receiving substrate is loaded onto a printing apparatus, a stencil having appertures therethrough is aligned to the substrate, a volume of viscous material is dispensed on a first surface of the stencil while a second surface of the stencil parallel to the first surface is in contact with a receiving surface of the substrate, and a squeegee is moved across the first surface of the stencil to transfer the viscous material through the apertures of the stencil onto the substrate, the method comprising the following consecutively-performed steps:

(a) rastering a surface portion of said viscous material on said first surface of the stencil adjacent to said squeegee with a laser profiling device;

(b) generating topographical data for the rastered surface portion of said viscous material;

(c) communicating the generated topographical data to a controller coupled to said laser profiling device; and

(d) comparing the topographical data communicated to said controller with predefined height or volume viscous material boundaries, said step of comparing determining whether additional viscous material is to be added to said first surface of the stencil in order to subsequently evenly distribute the viscous material through the apertures of the stencil onto the substrate.

7. The method of claim 6, further comprising the step of dispensing additional viscous material upon said first surface of said stencil when the step of comparing determines a need for additional viscous material.

8. The method of claim 7, wherein the step of dispensing is performed with a pneumatic dispenser.