SOI fabrication method

• US 5,710,057 A
• Filed: 07/12/1996
• Issued: 01/20/1998
• Est. Priority Date: 07/12/1996
• Status: Expired due to Fees

• Current Assignee: Donald M. Kenney
• Original Assignee: Donald M. Kenney
• Inventors: Kenney, Donald M.
• Primary Examiner(s): FOURSON III, GEORGE R
• Application Number:
  US08/679,021
• Time in Patent Office: 557 Days
• Field of Search: 437/62, 437/86, 437/974, 148/DIG. 12, 148/DIG. 135, 156/629.1, 117/915
• US Class Current: 438/406
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 21/7806 involving the separation of the active layers from a substrate
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: Y10S 117/915 Separating from substrate
• CPC Class Codes: Y10S 148/012 Bonding, e.g. electrostatic for strain gauges

Abstract

A first region of a seed substrate is separated from a bonded handle substrate by etching and/or fracturing a second region of the seed substrate. A third region of the seed substrate remains bonded to the handle wafer. Etching and etch ant distribution are facilitated by capillary action in trenches formed in the seed substrate prior to bonding of the handle substrate. A portion of the second region may be removed by undercut etching prior to handle bonding. Elevated pressure and etchant composition are used to suppress bubble formation during etching. Alternatively, pressure from bubble formation is used to fracture a portion of the second region. First, second, and third regions are defined by a variety of methods.

Claims

1. A method of forming a bonded structure comprising the steps of:

(a) providing a seed substrate having first, second, and third regions;

(b) forming a groove in said seed substrate;

(c) bonding a handle substrate to said third region;

(d) removing and/or fracturing said second region, whereby said first region is detached from the third region.

2. The method of claim 1 in which said groove extends into the second region.

3. The method of claim 2 in which said groove extends into the first region.

4. The method of claim 1 in which a portion of said second region is removed so as to undercut said third region prior to step (c).

5. The method of claim 1 further including use of the detached first region as a new seed substrate.

6. The method of claim 1 including etching the second region at elevated pressure.

7. The method of claim 1 in which a first sidewall spacer is used to define the thickness of the third region.

8. The method of claim 7 in which a second sidewall spacer is used to define the thickness of the second region.

9. A method of forming a bonded semiconductor on semiconductor structure comprising the steps of:

(a) providing a seed substrate having first, second, and third regions;

(b) forming a groove in said seed substrate;

(c) bonding a handle substrate to said third region;

(d) removing and/or fracturing said second region, whereby said first region is detached from the third region.

10. The method of claim 9 in which said groove extends into the second region.

11. The method of claim 10 in which said groove extends into the first region.

12. The method of claim 9 in which a portion of said second region is removed so as to undercut said third region prior to step (c).

13. The method of claim 9 further including use of the detached first region as a new seed substrate.

14. The method of claim 9 including etching the second region at elevated pressure.

15. A method of forming a bonded semiconductor on insulator structure comprising the steps of:

(a) providing a seed substrate having first, second, and third regions;

(b) forming a groove in said seed substrate;

(c) bonding a handle substrate to said third region;

(d) removing and/or fracturing said second region, whereby said first region is detached from the third region.

16. The method of claim 15 in which said groove extends into the second region.

17. The method of claim 16 in which said groove extends into the first region.

18. The method of claim 15 in which a portion of said second region is removed so as to undercut said third region prior to step (c).

19. The method of claim 15 further including use of the detached first region as a new seed substrate.

20. The method of claim 15 including etching the second region at elevated pressure.