Card like semiconductor device

• US 5,710,458 A
• Filed: 11/06/1995
• Issued: 01/20/1998
• Est. Priority Date: 12/20/1993
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): BROWN, PETER T
• Application Number:
  US08/554,104
• Time in Patent Office: 806 Days
• Field of Search: 340/572, 343/741-744, 343/787, 343/788, 343/702, 343/872, 343/873, 343/867, 257/679, 257/728, 257/531, 257/778, 235/491, 235/492
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A semiconductor package has high reliability and a simple structure and configuration, can be removed as a function section performing the main data processing, substantially improves retainability and portability, and is connected to external equipment without the need of contact. The semiconductor package comprises a circuit board on one main side of which has a region in which IC chips can be mounted, ac IC chip mounted in said region on the surface of the circuit board, a shield resin layer that buries or covers at least part of the mounted IC chip, at least one loop-like antenna pattern integrally formed in a region of the main side other than the region in which the IC chip is mounted for transmitting and receiving signals without the need of contact, and an antenna pattern for power induction located independently of said antenna pattern and inducing power electromagnetically. According to this semiconductor package, the antenna pattern for transmission and reception is also used to cause electromagnetic induction, and the induced power is used to drive the IC chip. This allows drive power batteries or external power connection terminals to be omitted, thereby substantially simplifying the handling of this package. Since this also obviates the need of the space for installing these power batteries and external power connection terminals, the package can be more compact.

Claims

1. A card like semiconductor device comprising:

a circuit board having a chip region on a main side thereof, said circuit board also including an antenna region separated from said chip region

an IC chip mounted along said chip region of said circuit board, said IC chip having at least one bump contact extending therefrom for electrically connecting said IC chip to said circuit board along said main side;

a protective resin layer substantially encapsulating said at least one bump contact;

a first loop-like antenna pattern for transmitting and receiving a signal, said first loop-like antenna pattern being formed integrally along said antenna region of said circuit board and being spaced from said IC chip for driving said IC chip by inducing power electromagnetically; and

a second loop-like antenna pattern formed on a rear side of said circuit board, said second loop-like antenna pattern being serially connected to said first loop-like antenna pattern.

2. A semiconductor device comprising:

a circuit board having a chip region on a main side there of, said circuit board also including an antenna region separate from said chip region;

an IC chip mounted along said chip region of said circuit board, said IC chip having at least one bump contact extending therefrom for electrically connecting said IC chip to said circuit board along said main side;

a protective resin layer substantially encapsulating said at least one bump;

a first loop-like antenna pattern for transmitting and receiving a signal, said first loop-like antenna pattern being formed integrally along said antenna region of said circuit board and being spaced from said IC chip for driving said IC chip by induction; and

a second loop-like antenna pattern formed on a rear side of said circuit board, said second loop-like antenna pattern being serially connected to said first loop-like antenna pattern.

3. A card like semiconductor device, comprising:

a circuit board having a chip region on a main side thereof, said circuit board also having a rear side opposite said main side;

an IC chip mounted along said chip region of said circuit board, said IC chip having at least one bump contact extending therefrom for electrically connecting said IC chip to said circuit board along said main side;

a protective resin layer substantially encapsulating said at least one bump contact;

a first loop-like antenna pattern spaced from said IC chip on said main side; and

a second loop-like antenna pattern, formed integrally on a rear side of said circuit board, said second loop-like antenna pattern being serially connected via through holes to said first loop-like antenna pattern to form a single antenna pattern for transmitting and receiving a signal without contacting an external source of power and for inducing power electromagnetically.

4. The semiconductor device according to claim 3, wherein the IC chip is mounted in a face-down relation along said chip region on said main side of said circuit board.

5. A card like semiconductor device comprising:

a circuit board having at least one two interconnected surfaces, wherein one of said at least two interconnected surfaces is a main surface;

an IC chip mounted along said surface of said circuit board, said IC chip having at least one bump contact for electrically connecting said IC chip to said circuit board along said main surface;

a protective resin layer substantially encapsulating said at least one bump contact;

a first loop-like antenna pattern formed integrally on said main surface, said first loop-like antenna pattern being spaced from said IC chip; and

a second loop-like antenna pattern formed on one of said at least two interconnected surfaces, said first and second antenna patterns driving said IC chip by inducing power electromagnetically,

wherein said at least two interconnecting surfaces include a rear surface, the semiconductor device further comprising;

a third loop-like antenna pattern formed on said rear surface of said circuit board and connected to said first loop-like antenna pattern via through holes; and

a fourth loop-like antenna pattern formed on said rear surface of said circuit board and connected to said second loop-like antenna pattern.