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Epoxy adhesives with dithiooxamide adhesion promoters

  • US 5,712,039 A
  • Filed: 04/11/1995
  • Issued: 01/27/1998
  • Est. Priority Date: 04/11/1995
  • Status: Expired due to Term
First Claim
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1. A curable, structural epoxy adhesive composition for bonding to oily metal comprising:

  • (a) an epoxy resin;

    (b) a phenalkylene amine curing agent for the epoxy resin; and

    (c) a compound of the formula I ##STR5## in which R1 and R2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O, wherein said compound of formula I is soluble in the adhesive composition and wherein said composition has a greater amount of cohesive failure when bonded to a steel surface coated with 150 mg/ft2 of oil than an otherwise identical composition without component (c).

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