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Copper foil for printed wiring board

  • US 5,712,047 A
  • Filed: 03/11/1996
  • Issued: 01/27/1998
  • Est. Priority Date: 02/24/1994
  • Status: Expired due to Term
First Claim
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1. A copper foil for a printed wiring board comprising a copper foil and a carbon-containing copper-zinc coating on at least one surface of the copper foil, the carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon, the carbon-containing copper-zinc coating being deposited from a plating solution containing a hydroxycarboxylic acid or a salt thereof and an aliphatic dicarboxylic acid or a salt thereof in aqueous solution.

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