Copper foil for printed wiring board

• US 5,712,047 A
• Filed: 03/11/1996
• Issued: 01/27/1998
• Est. Priority Date: 02/24/1994
• Status: Expired due to Term

• Current Assignee: EP Technologies Incorporated (Boston Scientific Corporation)
• Original Assignee: Nippon Denkai Ltd. (Resonac Holdings Corp.)
• Inventors: Kobayashi, Katsumi, Yamagishi, Takeshi, Aso, Kazuyoshi, Noguchi, Masami
• Primary Examiner(s): Zimmerman, John J.
• Application Number:
  US08/613,624
• Time in Patent Office: 687 Days
• Field of Search: 428/606, 428/607, 428/626, 428/623, 428/632, 428/658, 428/675, 428/634, 428/935
• US Class Current: 428/607
• CPC Class Codes: C25D 3/58 containing more than 50% by weight of copper
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/2063 mixed adhesion layer containing metallic/inorganic and polymeric materials
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 2203/0723 Electroplating, e.g. finish plating
• CPC Class Codes: H05K 3/384 by plating
• CPC Class Codes: Y10S 428/935 Electroplating
• CPC Class Codes: Y10T 428/12438 Composite
• CPC Class Codes: Y10T 428/12549 Adjacent to each other
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/12611 Oxide-containing component
• CPC Class Codes: Y10T 428/12792 Zn-base component
• CPC Class Codes: Y10T 428/1291 Next to Co-, Cu-, or Ni-base component

Abstract

A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

Claims

1. A copper foil for a printed wiring board comprising a copper foil and a carbon-containing copper-zinc coating on at least one surface of the copper foil, the carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon, the carbon-containing copper-zinc coating being deposited from a plating solution containing a hydroxycarboxylic acid or a salt thereof and an aliphatic dicarboxylic acid or a salt thereof in aqueous solution.

4. The copper foil of claim 1, wherein the carbon-containing copper-zinc coating is a coating formed by dipping the copper foil in a non-cyanide copper-zinc electroplating bath which comprises an aqueous solution containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof, and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode.

5. The copper foil of claim 1, wherein the at least one surface of the copper foil, on which the carbon-containing copper-zinc coating is provided, is a toughened surface, roughened by electrochemical or mechanical means.

6. The copper foil of claim 1, wherein the carbon-containing copper-zinc coating has a thickness of 0.05-1.0 μ

m.

7. The copper foil of claim 6, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

8. The copper foil of claim 1, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

9. The copper foil of claim 1, wherein the hydroxycarboxylic acid and salts thereof are selected from the group consisting of glycolic acid, lactic acid, malic acid, citric acid, gluconic acid, tartaric acid and glucoheptonic acid, and sodium salts, potassium salts, lithium salts, copper salts and zinc salts thereof.

10. The copper foil of claim 9, wherein the aliphatic dicarboxylic acid and salts thereof are selected from the group consisting of oxalic acid, malonic acid, succinic acid, maleic acid and fumaric acid, and sodium salts, potassium salts, copper salts and zinc salts thereof.

2. A copper foil for a printed wiring board comprising a copper foil, a carbon-containing copper-zinc coating on at least one surface of the copper foil, and a chromate-treatment coating on the carbon-containing copper-zinc coating, the carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon, the carbon-containing copper-zinc coating being deposited from a plating solution containing a hydroxycarboxylic acid or a salt thereof and an aliphatic dicarboxylic acid or a salt thereof in aqueous solution.

11. The copper foil of claim 2, wherein the carbon-containing copper-zinc coating is a coating formed by dipping the copper foil in a non-cyanide copper-zinc electroplating bath which comprises an aqueous solution containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof, and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode.

12. The copper foil of claim 2, wherein the carbon-containing copper-zinc coating has a thickness of 0.05-1.0 μ

m.

13. The copper foil of claim 12, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

14. The copper foil of claim 2, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

15. The copper foil of claim 2, wherein the chromate-treatment coating contains 10-90 μ

g/dm² of chromium.

3. A copper foil for a printed wiring board comprising a copper foil, a carbon-containing copper-zinc coating on at least one surface of the copper foil, a chromate-treatment coating on the carbon-containing copper-zinc coating, and a silane coupling agent coating on the chromate-treatment coating, the carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic of zinc and 0.1 to 20 atomic % of carbon, the carbon-containing copper-zinc coating being deposited from a plating solution containing a hydroxycarboxylic acid or a salt thereof and an aliphatic dicarboxylic acid or a salt thereof in aqueous solution.

16. The copper foil of claim 3, wherein the carbon-containing copper-zinc coating is a coating formed by dipping the copper foil in a non-cyanide copper-zinc electroplating bath which comprises an aqueous solution containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof, and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode.

17. The copper foil of claim 3, wherein the carbon-containing copper-zinc coating has a thickness of 0.05-1.0 μ

m.

18. The copper foil of claim 17, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

19. The copper foil of claim 3, wherein the carbon-containing copper-zinc coating comprises 45 to 70 atomic % of copper, 25 to 40 atomic % of zinc and 5 to 15 atomic % of carbon.

20. The copper foil of claim 3, wherein the silane coupling agent coating is a coating formed by applying an aqueous solution having a concentration of 0.001 to 5% by weight silane coupling agent.