Surface acoustic wave device
First Claim
Patent Images
1. A surface acoustic wave device comprising:
- a support substrate;
a surface acoustic wave element being soldered onto said support substrate to downwardly direct its surface wave propagation surface; and
a conductive cap being soldered to said supportsubstrate for enclosing said surface acoustic wave element, said surface acoustic wave element, said support substrate and said conductive cap being so formed as to satisfy α
3 ≧
α
1 when α
1 >
α
2, or to satisfy α
3 ≦
α
1 when α
1 <
α
2 assuming that α
1, α
2 and α
3 represent thermal expansion coefficients of said surface acoustic wave element, said support substrate and said conductive cap along the surface wave propagation direction respectively.
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Abstract
A SAW device (11) includes a SAW element (13) which is bonded onto a support substrate (12) in a face down mode through solder (19, 20), and a metal cap (21) enclosing the SAW element (13). Assuming that and α1, α2 and α3 represent the thermal expansion coefficients of the SAW element (13), the support substrate (12) and the conductive cap (21) along the surface wave propagation direction respectively, α3 ≦α1 when α1 >α2, and α3 ≦α1 when α1 <α2.
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Citations
5 Claims
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1. A surface acoustic wave device comprising:
-
a support substrate; a surface acoustic wave element being soldered onto said support substrate to downwardly direct its surface wave propagation surface; and a conductive cap being soldered to said support substrate for enclosing said surface acoustic wave element, said surface acoustic wave element, said support substrate and said conductive cap being so formed as to satisfy α
3 ≧
α
1 when α
1 >
α
2, or to satisfy α
3 ≦
α
1 when α
1 <
α
2 assuming that α
1, α
2 and α
3 represent thermal expansion coefficients of said surface acoustic wave element, said support substrate and said conductive cap along the surface wave propagation direction respectively. - View Dependent Claims (2, 3, 4, 5)
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Specification
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Current AssigneeMurata Manufacturing Co Limited
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Original AssigneeMurata Manufacturing Co Limited
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InventorsNakashima, Koji, Morishita, Hideya
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Primary Examiner(s)Dougherty, Thomas M.
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Application NumberUS08/495,895Time in Patent Office944 DaysField of Search310/313 R, 310/344, 310/346US Class Current310/313.00RCPC Class CodesH03H 3/10 for obtaining desired frequ...H03H 9/02834 of temperature influence cu...H03H 9/08 Holders with means for regu...
