Computer-aided method for producing resistive tapers and resistive taper produced thereby

• US 5,712,613 A
• Filed: 05/05/1995
• Issued: 01/27/1998
• Est. Priority Date: 05/05/1995
• Status: Expired due to Term

• Current Assignee: Mcdonnell Douglas Corporation (The Boeing Co.)
• Original Assignee: Mcdonnell Douglas Corporation (The Boeing Co.)
• Inventors: Podgajny, Thaddeus J., Buckner, Stephen C., Thomas, Matthew M.
• Primary Examiner(s): Evans, Geoffrey S.
• Assistant Examiner(s): EASTHOM, KARL D
• Application Number:
  US08/435,710
• Time in Patent Office: 998 Days
• Field of Search: 29/610.1, 29/620, 338/89, 338/217, 338/218, 338/283, 338/307, 338/308, 338/309, 148/DIG. 106, 148/DIG. 136, 216/16, 156/640.1
• US Class Current: 338/217
• CPC Class Codes: G03F 1/50 Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
• CPC Class Codes: G03F 1/54 Absorbers, e.g. of opaque materials
• CPC Class Codes: H01C 17/065 by thick film techniques, e.g. serigraphy
• CPC Class Codes: H01C 17/23 by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors
• CPC Class Codes: H01C 7/20 the resistive layer or coating being tapered
• CPC Class Codes: Y10T 29/49082 Resistor making
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base

Abstract

A method for producing a desired resistive taper under computer control for controlling the surface resistivity of an electrical element, which comprises the steps of creating a computer controlled optically graded pattern corresponding to the desired resistive taper, producing a phototool from the graded pattern and using the phototool to photochemically etch the graded pattern onto a substrate.

Claims

1. A method for producing a desired resistive taper under computer control for controlling surface resistivity comprising the steps of:

correlating along a function defining said desired resistive taper the magnitudes of surface resistivity to magnitudes representing optical gray levels to be outputted by said computer;

creating a computer-controlled optically graded pattern of said optical group levels on an phototool corresponding to said desired resistive taper; and

photochemically etching said computer-controlled optically graded pattern onto an insulating substrate having a conductive coating using said phototool.

2. The method of claim 1 wherein said phototool producing step comprises the step of printing said computer-controlled optically graded pattern onto a surface.

3. The method of claim 1 wherein said phototool producing step comprises the step of printing said computer-controlled optically graded pattern onto a transparent film surface.

4. The method of claim 1 wherein said phototool producing step comprises the step of producing said phototool by photographic means.

5. The method of claim 1 wherein said phototool producing step comprises the step of printing said computer-controlled optically graded pattern onto a sheet of paper, photographing said sheet of paper, and printing said photograph onto a transparent film surface.

6. The method of claim 1 further comprising the step of enlarging said computer-controlled optically graded pattern using photographic means prior to producing said phototool, said phototool producing step comprising the step of producing said phototool from said enlarged computer-controlled optically graded pattern.

7. The method of claim 1 wherein said photochemical etching step comprises the step of photochemically etching said computer-controlled optically graded pattern into a conductive layer deposited onto an insulating material.

8. The method of claim 1 wherein said substrate comprises copper-coated polymeric film.

9. A resistive taper produced by the method of claim 1 wherein said function defining said desired taper is selected from the group consisting of linear, exponential, hyperbolic cosine, cosine squared, Weber function, or rectified sine wave, and said conductive coating has a pattern corresponding to said optical gray levels of said graded pattern thereby creating said desired taper.

10. The method of claim 1 wherein the insulating substrate and the conductive coating substantially determine the surface resistivity.

11. A resistive taper produced by the method of claim 10 wherein said function defining said desired taper is selected from the group consisting of linear, exponential, hyperbolic cosine, cosine squared, Weber function, or rectified sine wave, and said conductive coating has a pattern corresponding to said optical gray levels of said graded pattern thereby creating said desired taper.