Thermal protection of traction inverters

• US 5,712,802 A
• Filed: 04/16/1996
• Issued: 01/27/1998
• Est. Priority Date: 04/16/1996
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Macchiaroli, Peter Billey, Kumar, Ajith Kuttannair
• Primary Examiner(s): Trammell, James P.
• Assistant Examiner(s): Pipala, Edward J.
• Application Number:
  US08/633,390
• Time in Patent Office: 651 Days
• Field of Search: 364/480, 364/481, 364/483, 364/492, 364/495, 364/505, 364/506, 364/524, 364/550, 364/557, 364/558, 364/551.01, 363/50, 363/141, 374/40, 374/41, 290/1 B, 361/688, 361/690, 361/691, 361/695, 361/699, 323/236, 323/907, 310/68 B, 310/68 C, 310/68 D, 318/471, 318/472, 318/473, 257/712, 257/713, 257/721, 165/80.3, 165/275, 165/278, 165/279, 165/287, 165/293, 165/295
• US Class Current: 702/132
• CPC Class Codes: G05D 23/1917 using digital means
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
• CPC Class Codes: H05K 7/20945 Thermal management, e.g. inverter temperature control

Abstract

A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown includes the steps of computing the cooling air mass flow rate, creating an electronic model of the semiconductor/heat sink combination and estimating the semiconductor junction temperature from the mass flow rate and model. The cooling mass flow rate is determined by measuring the temperature of the cooling air prior to passage over the heat sink, measuring atmospheric pressure of the cooling air, determining the volumetric air flow rate of the cooling air and computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate. Power dissipation in the semiconductors is then computed and heat sink and semiconductor temperatures are estimated from power dissipation and cooling air mass flow rate. Semiconductor power dissipation is limited so as to restrict semiconductor temperature to a safe operating value.

Claims

1. A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown, the method comprising the steps of:

measuring the temperature of the cooling air prior to passage over the heat sink;

measuring atmospheric pressure of the cooling air;

determining the volumetric air flow rate of the cooling air;

computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate;

calculating power dissipation in the semiconductors;

estimating heat sink and semiconductor temperatures from the calculated power dissipation and computed cooling air mass flow rate; and

limiting semiconductor power dissipation so as to restrict semiconductor temperature to a safe operating value.

2. The method of claim 1 and including the step of controlling the volumetric air flow rate to regulate semiconductor temperature.

3. The method of claim 1 wherein the step of calculating power dissipation includes the steps of:

computing switching losses in the semiconductors from monitored values of applied DC voltage, switching frequency, fundamental output current frequency and current magnitude;

calculating power factor from measured values of current, torque, fundamental output current frequency, applied DC voltage and modulation index;

computing semiconductor conduction losses from the calculating power factor, measured current and modulation index; and

summing the switching losses and conduction losses to obtain power dissipation.

4. The method of claim 1 wherein the step of estimating includes the steps of:

creating an electronic model simulating the thermal characteristics of the heat sink and semiconductors; and

computing semiconductor temperature from the electronic model based on computed power dissipation and cooling air mass flow rate.

5. The method of claim 1 wherein the cooling air is supplied from a blower and the step of computing the cooling air mass flow rate comprises the steps of:

measuring cooling air flow rate at ##EQU2## a fixed blower speed;

computing cooling air flow rate ##EQU3## at other blower speeds in direct proportion to the flow rate at the fixed speed;

computing a standard air mass flow rate from the relationship ##EQU4## computing an actual air mass flow rate from the standard air mass flow rate in which actual flow rate is determined from;

##EQU5## where R is mass flow, T is temperature and P is atmospheric pressure.