Method of manufacturing a compound semiconductor thin film for a photoelectric or solar cell device
First Claim
1. A method of forming a compound semiconductor thin film on a thin film forming substrate, comprising the step of:
- thermally decomposing a sulfur-containing metal organic compound at a temperature above 300°
C., said compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom.
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Abstract
This invention relates to a manufacturing method of a compound semiconductor thin film derived from a metal sulfide produced by thermal decomposition of a sulfur-containing metal organic compound, the compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, and the functional group also containing at least one sulfur atom. Since the obtained metal sulfides are of high-purity and dense, they can be utilized in various photoelectric devices. Particularly, the photoelectric conversion efficiency of a CdS/CdTe system thin film compound semiconductor solar cell can be improved remarkably by employing a layer made of a CdS thin film as a window of the solar cell.
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Citations
15 Claims
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1. A method of forming a compound semiconductor thin film on a thin film forming substrate, comprising the step of:
thermally decomposing a sulfur-containing metal organic compound at a temperature above 300°
C., said compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom.- View Dependent Claims (2, 3)
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4. A method of forming a metal sulfide compound semiconductor thin film on a thin film forming substrate, comprising the steps of:
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volatizing a metal organic compound containing sulfur at a temperature above 300°
C. from a metal organic compound supplying substrate by thermal evaporation, said metal organic compound supplying substrate having a face coated with said metal organic compound,depositing said metal organic compound onto said thin film forming substrate, thermally decomposing said deposited metal organic compound at a temperature higher than a temperature at which said thermal evaporation is performed, and crystallizing a thin film of said metal sulfide compound semiconductor on said thin film forming substrate. - View Dependent Claims (5)
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6. A method of forming a metal sulfide compound semiconductor thin film on a thin film forming substrate, comprising the steps of:
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disposing a sulfur containing metal organic compound supplying substrate having a face coated with a sulfur containing metal organic compound at a close distance facing said thin film forming substrate, heating said metal organic compound supplying substrate to at least the volatization temperature of said metal organic compound to volatize and thermally evaporate said metal organic compound from said metal organic compound supplying substrate, depositing said metal organic compound onto said thin film forming substrate, thermally decomposing said deposited metal organic compound by maintaining said thin film forming substrate at least at a thermal decomposition temperature of said metal organic compound, and crystallizing a thin film of said metal sulfide compound semiconductor on said thin film forming substrate.
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7. A method of forming a compound semiconductor thin film, comprising the steps of:
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providing a substrate, forming a solution by dissolving in an organic solvent at least one metal organic compound selected from the group consisting of mercaptide, thioate, dithioate, thiocarbonate, dithiocarbonate, trithiocarbonate, thiocarbamate and dithiocarbamate of a metal element selected from the group consisting of copper, zinc, cadmium, mercury, and lead, coating said substrate with a layer of said solution using a printing method, drying said layer on said substrate, and thermally decomposing said layer at a temperature above 300°
C. to form said compound semiconductor thin film on said substrate. - View Dependent Claims (8, 9)
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10. A method of manufacturing photoelectric device, comprising the steps of depositing a first electrode on an electrically insulating sheet selected from the group consisting of ceramic, glass, and resin,
forming a first compound semiconductor thin film of metal sulfide on the surface of said electrode by thermally decomposing a sulfur-containing metal organic compound at a temperature above 300° - C., said compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom,
forming a second compound semiconductor thin film on the surface of said metal sulfide thin film using a proximity sublimation method, wherein said second compound semiconductor thin film is segmented to expose portions of said first compound semiconductor thin film, forming a second electrode of carbon on said second compound semiconductor thin film, and forming a third electrode which contacts both said first compound semiconductor thin film and said second electrode of an adjacent segment of said second compound semiconductor thin film. - View Dependent Claims (11)
- C., said compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom,
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12. A method of forming a compound semiconductor solar cell provided with a p-n junction, comprising the steps of:
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forming a transparent conductive electrode made of indium oxide or indium-tin oxide on a transparent and electrically insulating sheet of soda-lime glass or polyamide resin, forming an n-type semiconductor window layer on the surface of said transparent conductive electrode, said n-type semiconductor window layer being a metal sulfide thin film formed by thermally decomposing a sulfur-containing metal organic compound at a temperature above 300°
C., said compound containing at least one functional group having at least one metal atom selected from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom, andforming a p-type semiconductor thin film layer of cadmium telluride on said n-type semiconductor window layer. - View Dependent Claims (13)
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14. A method of forming a compound semiconductor solar cell provided with a p-n junction, comprising the steps of:
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depositing an n-type semiconductor window layer by thermally decomposing a sulfur-containing metal organic compound at a temperature above 300°
C., said compound containing at least one functional group having at least one metal atom selected-from the group consisting of copper, zinc, cadmium, mercury, and lead, said functional group also containing at least one sulfur atom, onto a p-type semiconductor layer consisting of cadmium telluride or copper-indium selenide,said p-type semiconductor deposited on a surface of a metal sheet selected from the group consisting of copper, copper plated with silver, platinum, or molybdenum, iron plated with copper, silver, platinum, or molybdenum, stainless steel plated with copper, silver, platinum, or molybdenum, and an electro-insulating sheet with a conductive electrode. - View Dependent Claims (15)
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Specification