Stacked planar transformer

• US 5,716,713 A
• Filed: 12/16/1994
• Issued: 02/10/1998
• Est. Priority Date: 12/16/1994
• Status: Expired due to Fees

• Current Assignee: Laserage Technology Corp. (Ametek Incorporated)
• Original Assignee: Ceramic Packaging, Inc.
• Inventors: Balents, Leon M., Zsamboky, Kalman F.
• Primary Examiner(s): SPEER, TIMOTHY M
• Application Number:
  US08/358,203
• Time in Patent Office: 1,152 Days
• Field of Search: 428/457, 428/469, 428/689, 428/699, 428/701, 428/702, 428/901, 427/98, 427/377, 427/372.2, 427/376.1, 427/376.2, 427/376.3, 427/376.7, 427/379, 427/383.7, 427/383.3, 336/182, 336/183, 336/232, 228/208, 228/209, 228/230
• US Class Current: 428/457
• CPC Class Codes: C04B 41/0072 Heat treatment
• CPC Class Codes: C04B 41/52 Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
• CPC Class Codes: C04B 41/80 of only ceramics
• CPC Class Codes: C04B 41/89 for obtaining at least two superposed coatings having different compositions
• CPC Class Codes: C23C 8/02 Pretreatment of the material to be coated C23C8/04 takes precedence
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H02K 3/26 consisting of printed conductors
• CPC Class Codes: H02N 1/004 in which a body is moved along a path due to interaction with an electric field travelling along the path
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A process for preparing an insulated metallized substrate, wherein a specified metallized substrate is heated from ambient temperature to a peak temperature of at least about 800 degrees centigrade while contacting the substrate with an inert atmosphere containing less than 10 parts per million of oxygen, maintained at such peak temperature for a specified period of time while being contacted with said inert gas, and thereafter heated at a peak temperature of at least about 800 degrees centigrade while being contacted with a gas containing at least 100 parts per million of oxygen.

Claims

1. A stacked planar transformer, which comprises:

(a) a first workpiece having a first working surface unitary with said first workpiece,

(b) a first layer of electrically conductive metal on said first working surface, and a heterogeneous juncture band between said first workpiece and said first conductive metal layer, substantially coextensive with said conductive metal layer and said working surface, wherein;

2. said heterogeneous juncture band consists essentially of grains unitary with said first workpiece and conductive metal unitary with said conductive metal layer and is constituted by finger-like metal protuberances unitary with the metal layer and occupying the space between said grains, and wherein said metallized substrate is capable of withstanding repeated firing cycles at a temperature in excess of 400 degrees centigrade without separation of the metal layer from the working surface of the workpiece, andsaid layer of electrically conductive metal has a thickness of from about 10 to about 250 microns,

(c) a first layer of dielectric material disposed above said first layer of conductive metal;

(d) a second layer of conductive metal disposed on said first layer of dielectric material, wherein said second layer of conductive metal defines a continuously coiled arcuate shape with a substantially circular cross-section;

(e) a second workpiece having a second working surface unitary with said second workpiece, wherein said second workpiece is disposed below said first workpiece;

(f) a third layer of electrically conductive metal on said second working surface, and a heterogeneous juncture band between said second workpiece and said third conductive metal layer, substantially coextensive with said conductive metal layer and said second working surface, wherein;

1. said heterogeneous juncture band consists essentially of grains unitary with said second workpiece and conductive metal unitary with said conductive metal layer and is constituted by finger-like metal protuberances unitary with the metal layer and occupying the space between said grains, and wherein said metallized substrate is capable of withstanding repeated firing cycles at a temperature in excess of 400 degrees centigrade without separation of the metal layer from the working surface of the second workpiece, and

2. said third layer of electrically conductive metal has a thickness of from about 10 to about 250 microns,

(g) a second layer of dielectric material disposed above said third layer of conductive metal;

(h) a fourth layer of conductive metal disposed on said second layer of dielectric material, wherein said second layer of conductive metal defines a continuously coiled arcuate shape with a substantially circular cross-section;

(i) a first ferrite core extending through said first workpiece; and

(j) a second ferrite core extendinq through said second workpiece, wherein said second ferrite core is contiguous with said first ferrite core.