Removable optoelectronic module

• US 5,717,533 A
• Filed: 04/06/1995
• Issued: 02/10/1998
• Est. Priority Date: 01/13/1995
• Status: Expired due to Term

• Current Assignee: Stratos International Incorporated (Emerson Electric Company)
• Original Assignee: Methode Electronics Incorporated
• Inventors: McGinley, James W., Poplawski, Daniel S.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vu, Phuong T.
• Application Number:
  US08/417,914
• Time in Patent Office: 1,041 Days
• Field of Search: 361/796, 361/801, 361/802, 361/752-759, 385/88-89, 385/92, 385/94, 257/432, 257/433, 439/131, 439/153, 439/76.1, 439/74, 439/77, 439/946, 439/493, 439/465, 439/466, 439/469
• US Class Current: 361/752
• CPC Class Codes: G02B 6/3817 containing optical and electrical conductors cables including electrical and optical conductors H01B11/22; G02B6/3816 takes precedence
• CPC Class Codes: G02B 6/3831 comprising a keying element on the plug or adapter, e.g. to forbid wrong connection keying element on the ferrule G02B6/3851; keying element for electrical coupling H01R13/64
• CPC Class Codes: G02B 6/3849 using mechanical protective elements, e.g. caps, hoods, sealing membranes G02B6/3816 takes precedence; provisionally see H01R13/44
• CPC Class Codes: G02B 6/3897 Connectors fixed to housings, casing, frames or circuit boards G02B6/44528 takes precedence
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01R 13/6581 Shield structure
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal

Abstract

A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly.

Claims

1. An optoelectronic module comprising:

a housing including a first end wall having a through port and adjacent the through port a metallized transceiver connector;

a circuit board mounted within said housing and an optical subassembly electrically connected to said circuit board and adjacent said through port; and

an electrical connector at a second end of said housing connected to said circuit board and protruding from said housing for quickly installing and replacing said module to or from a circuit card assembly and the electrical connector including at least a pair of metallic fingers extending from said housing.

2. The optoelectronic module of claim 1 wherein the metallic fingers are separated by an insulator.

3. The optoelectronic module of claim 1 wherein the electrical connector includes a beam of insulative material having electrical contacts.

4. The optoelectronic module of claim 1 wherein the electrical connector protrudes perpendicularly from the second end parallel to the circuit board.

5. The optoelectronic module of claim 1 wherein said electrical connector is a male ribbon-style connector.

6. The optoelectronic module of claim 1 wherein said housing includes a mounting member for facilitating the insertion and removal of said module to and from a circuit card assembly.

7. The optoelectronic module of claim 1 wherein the housing forms a potting box for the potting of the optical subassembly.

8. The optoelectronic module of claim 1 wherein the transceiver connector includes a grounding clip attached to a slot on the transceiver connector.

9. The optoelectronic module of claim 1 wherein the housing is metallized in order to provide for the grounding of the housing and provide for the dissipation of electrostatic discharge and provide for electromagnetic shielding.

10. The optoelectronic module of claim 9 wherein the housing is metallized separately from the metallization of the transceiver connector.

11. The optoelectronic module of claim 1 wherein the electrical connector at the second end connects to a receptacle mounted on a daughter board within the chasis of an electronic apparatus.

12. The optoelectronic module of claim 11 wherein the optoelectronic module achieves a ground potential equal to that of the electronic apparatus.