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Apparatus and method for spray-cooling an electronic module

  • US 5,718,117 A
  • Filed: 04/10/1996
  • Issued: 02/17/1998
  • Est. Priority Date: 04/10/1996
  • Status: Expired due to Fees
First Claim
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1. An apparatus for spray-cooling an electronic module, the apparatus comprising:

  • a plate having a first layer and a second layer opposed to the first layer, the plate sized to be slidably mounted in a housing;

    a first fluid distributing conduit disposed in the second layer;

    a second fluid distributing conduit disposed in the second layer;

    a first nozzle housing having a first aperture, the first nozzle housing disposed in the first fluid distributing conduit; and

    a second nozzle housing having a second aperture, the second nozzle housing disposed in the second fluid distributing conduit.

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