Modified polyphenylene ether-polyamide compositions and process

• US 5,719,233 A
• Filed: 03/20/1995
• Issued: 02/17/1998
• Est. Priority Date: 05/21/1984
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Avakian, Roger W., van der Meer, Roelof, Gallucci, Robert R.
• Primary Examiner(s): Woodward, Ana
• Application Number:
  US08/407,789
• Time in Patent Office: 1,065 Days
• Field of Search: 525/397, 525/92 B, 525/66, 525/133
• US Class Current: 525/92.00B
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 71/00 Compositions of polyethers obtained by reactions forming an ether link in the main chain of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 71/123 not modified by chemical after-treatment
• CPC Class Codes: C08L 77/00 Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08; Compositions of derivatives of such polymers

Abstract

Novel modified polyphenylene ether-polyamide compositions comprising polyphenylene ether, polyamide and a polycarboxylic acid and the reaction product thereof and an improved process for preparing the same.

Claims

1. A novel resin composition comprising:

a) one or more polyphenylene ether resins,

b) one or more polyamide resins, and

c) a compatibilizer consisting of one or more aliphatic polycarboxylic acids or derivatives thereof present at a level effective to improve compatibility and impact strength of the composition, said level of polycarboxylic acid or derivative thereof being from about 0.05 to about 4% by weight, based on the weight of the total composition, said aliphatic polycarboxylic acid or derivative thereof being represented by the formula;

space="preserve" listing-type="equation">(R.sup.I O).sub.m R(COOR.sup.II).sub.n (CONR.sup.III R.sup.IV).sub.s

wherein R is a linear or branched chain, saturated aliphatic hydrocarbon of from 2 to 20 carbon atoms;

R^I is selected from the group consisting of hydrogen, and alkyl, aryl, acyl and carbonyl dioxy groups having from 1 to 10 carbon atoms;

each R^II is independently selected from the group consisting of hydrogen, and alkyl or aryl groups having from 1 to 20 carbon atoms;

each R^III and R^IV is independently selected from the group consisting of hydrogen, and alkyl or aryl groups having from 1 to 10 carbon atoms;

m is equal to 1 and (n+s) is greater than or equal to 2, and n and s are each greater than or equal to 0;

wherein (OR^I) is alpha or beta to a carbonyl group and at least 2 carbonyl groups are separated by 2 to 6 carbon atoms; and

wherein the ratio of polyphenylene ether to polyamide is from 5 to 95% by weight of the former to 95 to 5% by weight of the latter,

said composition further comprising from 2 to about 50% by weight based on the total composition of a modifier resin, and said modifier resin selected from the group consisting of vinyl aromatic hydrogenated conjugated diene block copolymers, vinyl aromatic partially hydrogenated conjugated diene block copolymers, and vinyl aromatic non-hydrogenated conjugated diene triblock copolymers.

2. The composition of claim 1 wherein the modifier resin is present in an amount of up to about 35% by weight based on the total composition.

3. The resin composition of claim 1, wherein said compatibilizer is selected from the group consisting of anhydrous citric acid, citric acid hydrate, anhydrous malic add, malic acid hydrate, anhydrous agaricic acid, agaricic acid hydrate, and acid amide derivatives of any of the foregoing.

4. The resin composition of claim 1 wherein the ratio of polyphenylene ether to polyamide is from 30 to 70% by weight of the former to 70 to 30% by weight of the latter.

5. The resin composition of claim 1, wherein said modifier resin is a vinyl aromatic non-hydrogenated conjugated diene triblock copolymer.

6. The resin composition of claim 5, wherein said vinyl aromatic non-hydrogenated conjugated diene triblock copolymer is a polystyrene-polybutadiene-polystyrene triblock copolymer.

7. The resin composition of claim 1, wherein said aliphatic polycarboxylic acid is citric acid hydrate.

8. The resin composition of claim 1, wherein said aliphatic polycarboxylic acid is citric acid.

9. The resin composition of claim 1, wherein said aliphatic polycarboxylic acid is malic acid.