Semiconductor package with a bridge for chip area connection
First Claim
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1. In a semiconductor package of the type having a base having a recessed central portion for receiving a chip and a perimeter portion having electrical connection means which are connected through said base to outer connection means, the improvement comprising:
- a bridge extending over said semiconductor chip and supported at said perimeter portion, said bridge having a plurality of conductive strips thereon, said strips facing away from said chip;
a first one of said plurality of conductive strips connected to a first reference voltage at said base;
said chip having a plurality of bonding pads which enable external connection of circuits contained in said chip, said bonding pads located adjacent said bridge; and
means for selectively connecting said plurality of conductive strips to said bonding pads.
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Accused Products
Abstract
A semiconductor package including a base having a chip receiving portion and a surrounding portion; a bridge having conductive strips extending over the chip and supported at the surrounding portion; wires connect the conductive strips to power and ground; and wires connect the conductive strips to chip area power and ground bonding pads. Decoupling capacitors may be mounted on the base.
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Citations
10 Claims
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1. In a semiconductor package of the type having a base having a recessed central portion for receiving a chip and a perimeter portion having electrical connection means which are connected through said base to outer connection means, the improvement comprising:
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a bridge extending over said semiconductor chip and supported at said perimeter portion, said bridge having a plurality of conductive strips thereon, said strips facing away from said chip; a first one of said plurality of conductive strips connected to a first reference voltage at said base; said chip having a plurality of bonding pads which enable external connection of circuits contained in said chip, said bonding pads located adjacent said bridge; and means for selectively connecting said plurality of conductive strips to said bonding pads. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor package for making electrical connections to a semiconductor die, comprising:
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a base having a perimeter portion and a central portion, said central portion recessed for receiving a semiconductor die; said die having a first edge and a second edge perpendicular to said first edge; a bridge extending over said semiconductor die, said bridge formed of insulative material and having a first member and a second member, with said first member and said second member forming a cross having ends, with said ends supported at said perimeter; first and second conductive strips formed on said bridge, said first conductive strip connected to a first reference voltage and said second conductive strip connected to a second reference voltage; said die having a plurality of bonding pads which enable external connection of circuits contained in said chip, said bonding pads located adjacent said bridge; and means for selectively connecting said plurality of conductive strips to said bonding pads. - View Dependent Claims (9, 10)
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Specification