Inspection system for cross-sectional imaging

• US 5,719,952 A
• Filed: 05/14/1996
• Issued: 02/17/1998
• Est. Priority Date: 01/19/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Rooks, Stephen Michael
• Primary Examiner(s): Couso, Jose L.
• Assistant Examiner(s): Do, Anh Hong
• Application Number:
  US08/645,946
• Time in Patent Office: 644 Days
• Field of Search: 382/149, 382/150, 378/22
• US Class Current: 382/150
• CPC Class Codes: G01N 2223/419 computed tomograph
• CPC Class Codes: G01N 23/044 using laminography or tomosynthesis
• CPC Class Codes: G01N 23/046 using tomography, e.g. computed tomography [CT]
• CPC Class Codes: G01N 23/083 the radiation being X-rays
• CPC Class Codes: G01N 23/18 Investigating the presence of flaws defects or foreign matter
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates
• CPC Class Codes: G06T 2207/10116 X-ray image
• CPC Class Codes: G06T 2207/30152 Solder
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: G06T 7/0006 using a design-rule based approach
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method and apparatus for inspecting a bonded joint between components. A cross-sectional image of the joint is analyzed by determining the location of a first characteristic of the joint, the centroid of the joint in the cross-sectional image; and then measuring a second characteristic of the joint in reference to the location of the centroid. This measurement may be used by comparing it with a predetermined specification expected for the measurement for the purpose of determining the quality of the joint. The invention is particularly advantageous for studying cross-sectional X-ray images of solder joints between electronic components and substrata upon which they are mounted and can be implemented for analyzing the images produced in cross-sectional X-ray inspection machines such as scanned beam X-ray laminography systems or digital tomosynthesis systems.

Claims

1. A method of inspecting a bonded joint between a first and a second component at connectors of said components, comprising the steps of:

using cross-sectional images of said joint generated;

in a first plane intersecting said joint at;

a) a position substantially medial of said joint between said components, and

in a second plane at one of;

b) a position substantially at said first component, and

b1) a position substantially at said second component;

determining the location of the centroid of said bonded joint in said cross-sectional image taken at said medial position;

determining the location of the centroid of said bonded joint in one of said cross-sectional images taken at a connector of one of said first and second components;

measuring an offset of said joint by comparing the position of the centroid of said joint taken in said first plane to the position of the centroid of said joint taken in said second plane; and

comparing said offset to a predetermined value to determine the acceptability of said joint.

2. The method of inspecting a bonded joint as recited in claim 1, further comprising:

adjusting subsequent measurements of said bonded joint in said cross-sectional image taken in said second plane based on said offset to account for the shape of said bonded joint; and

comparing the measurement of said joint at a connector of one of said components with a predetermined value for the purpose of determining the acceptability of said joint.

3. The method of inspecting a bonded joint as recited in claim 1, further comprising the steps of:

measuring the thickness of said bonded joint in said cross-sectional image taken in said second plane, in at least one region that is defined by said centroid of said joint taken at said connector and by said offset of said joint; and

comparing said thickness of said joint to a predetermined value to determine the acceptability of said joint.

4. The method of inspecting a bonded joint as recited in claim 1, further comprising the steps of:

measuring geometrical dimensions of said joint in said cross-sectional image taken in said second plane, in at least one region that is defined by said centroid of said joint taken at said connector and by said offset of said joint; and

comparing said geometrical dimensions of said joint to a predetermined value to identify whether said joint is defective.

5. The method of claim 1, wherein measuring said joint at said connector of one of said components further comprises measuring a selected region of the perimeter of said joint in said cross-sectional image.

6. The method of claim 1, wherein said measuring said joint at said connector of one of said components further comprises measuring a selected region of bonding material of said joint in said cross-sectional image.

7. The method of claim 1, wherein said measuring said joint at said connector of one of said components further comprises measuring the density of a selected region of bonding material of said joint in said cross-sectional image.

8. The method of inspecting a bonded joint as recited in claim 1, further comprising the steps of:

checking for the presence of bonding material between said bonded joint and adjacent said bonded joints in at least one region that is defined by said centroid of said joint at said connector and by said offset of said joint; and

comparing said presence of bonded material in said at least one region to a predetermined specification to determine whether said bonded joint is bridged to adjacent said bonded joints.

9. A method of inspecting a bonded joint between a first and a second component at connectors of said components, comprising the steps of:

using penetrating radiation to generate cross-sectional images of said joint generated;

in a first plane intersecting the longitudinal axis of said joint extending between said components at;

a) a position substantially medial of said joint between said components, and

in a second plane at one of;

b) a position substantially at said first component, and

b1) a position substantially at said second component;

determining the location of the centroid of said bonded joint in said cross-sectional image taken at said medial position;

determining the location of the centroid of said bonded joint in one of said cross-sectional images taken at a connector of one of said first and second components;

determining an offset of said joint by comparing said image of the centroid of said joint taken at said medial position to said image of the centroid of said joint taken at said connector; and

comparing said offset to a predetermined value to determine the acceptability of said joint.

10. The method of inspecting a bonded joint as recited in claim 9 further comprising:

comparing the measurement of said joint at a connector of one of said components with a predetermined specification for the purpose of determining the quality of said joint.

11. A method of inspecting a solder joint between components comprising the steps of:

generating cross-sectional images of the joint in a plurality of substantially parallel spaced planes intersecting said joint,

determining the location of a first characteristic of said joint comprising the centroid of said joint in one of said cross-sectional images;

measuring a second characteristic of said joint in reference to the location of said centroid of said joint in another of said other cross-sectional images; and

comparing the location of said first and second characteristics of said joints with a predetermined specification for the purpose of determining the quality of said joint.

12. The method of claim 11, wherein said components comprise an electronic module and a substrate to which said module is mounted, said solder joint comprising a soldered connection between a termination of said electronic module and a corresponding connection means on said substrate, and

said cross sectional images comprising images across said termination and across said connection means proximate to said joint, and across a central portion of said solder joint.

13. The method of claim 11, wherein measuring said centroid of said joint in another said other cross-sectional images further comprises measuring a selected region of the perimeter of said interconnection in any of said cross-sectional images.

14. The method of claim 11, wherein measuring said centroid of said joint in another of said other cross-sectional images further comprises measuring a selected region of solder of said joint in any of said cross-sectional images.

15. The method of claim 11, wherein measuring said centroid of said joint in another of said other cross-sectional images further comprises measuring the density of a selected region of solder of said joint in any of said cross-sectional images.

16. The method of claim 11, wherein said solder joint comprises multiple compositions of solder,

said first characteristic comprises the centroid of all solder in said joint in one of said cross-sectional images, and

said second characteristic comprises the centroid of one of said multiple compositions in said solder joint in another said cross-sectional images.

17. A method of inspecting solder joints between components comprising the steps of:

using a stored cross-sectional image of the joints generated in at least one of parallel planes intersecting said joints;

determining the location of a first characteristic of each of said joints, said characteristic comprising the centroid of each said joint in one of said cross-sectional images; and

measuring a second characteristic of each of said joints in reference to the location of said centroids,

wherein said components comprise a component module having terminations and a substrate to which said electronic component is attached, and

said solder joints comprise solder joints for joining said terminations of said electronic component and corresponding substrate connection means on said substrate.

18. The method of claim 17 wherein said components comprise a component module having electrical terminations and a substrate to which said electronic component is attached,

said solder joints comprising solder joints for joining said electrical terminations of said electronic component and corresponding electrical substrate connection means on said substrate.

19. The method of claim 17 wherein said cross-sectional images are generated substantially parallel to said component module or substrate;

said images being generated at an image plane intersecting said module through said module terminations proximate to said joints, at an image plane intersecting said substrate through said substrate connection means proximate to said joints, and across said joints between said substrate and said module.

20. The method of claim 19 wherein said joints are formed in accordance with ball grid array methods using solder balls for joint formation, wherein

said substrate connection means comprises pads for soldering,

said cross-sectional image across said substrate is made through said pads, and

said cross-sectional image across said joints being made through said solder balls.

21. A method of inspecting multiple solder joints between components comprising the steps of:

using a cross-sectional image of the joints generated in a plane intersecting said joints between said components;

determining the location of a first characteristic of each of said joints, said characteristic comprising the centroid of each said joints in said cross-sectional image; and

measuring a second characteristic of each of said joints in reference to the location of said centroids,

wherein the relationship between said measurement of said characteristic and the location of said centroids is determined and compared to predetermined specifications for the purpose of determining the quality of said joints.

22. The method of claim 21 wherein measuring said second characteristic comprises measuring a selected region of the perimeter of each said joint in said cross-sectional image.

23. The method of claim 22 wherein the distance between the closest portions of the perimeter of two adjacent joints along a line between the centroids of said two joints is compared to a predetermined specification for the purpose determining the quality of said joints.

24. The method of claim 21 wherein the measurement of said second characteristic of each joint is compared with the central tendency of the measurements of said second characteristics for said joints to determine whether said comparisons satisfy a predetermined specification.

25. A method of inspecting ball grid array solder joints between components comprising the steps of:

generating a cross-sectional image of the joints in a plane intersecting said joints between said components;

determining the location of the centroid of each solder ball in said joints in said cross-sectional image; and

measuring a characteristic of each of said joints in reference to the location of said centroids,

wherein the relationship between said measurements of said characteristic and the location of said centroids is determined and compared to predetermined specifications for the purpose of determining the quality of said joints.