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Multicolor organic light emitting devices

  • US 5,721,160 A
  • Filed: 04/15/1996
  • Issued: 02/24/1998
  • Est. Priority Date: 12/13/1994
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating a hermetically packaged multicolor light emitting device (LED), comprising the steps of:

  • forming a first transparent conductive layer upon a transparent substrate;

    masking said first conductive layer for depositing an SiO2 layer thereupon in a concentric pattern;

    forming on a portion of said first SiO2 layer at least one multicolor LED, each including at least a first and a second organic light emitting devices (LED'"'"'s) stacked one upon the other to form a layered structure upon said first SiO2 layer;

    depositing via shadow masking a plurality of metal contacts or circuit paths each having one end terminating near an outer edge of said first SiO2 layer, and each having another end terminating on an individual biasing electrode of said at least one multicolor LED;

    depositing via shadow masking a second SiO2 layer as a ring concentric with said first SiO2 layer and over outer portions of said plurality of metal contacts but leaving exposed said one ends thereof;

    depositing a ring of low temperature melting solder over and concentric with said second SiO2 ring;

    depositing on the bottom of a cover glass a metal ring positioned to be coincident with said ring of solder;

    installing said cover glass over said substrate and at least one multicolor LED, with said ring of solder abutting against said metal ring on said cover glass;

    placing the assembly in an inert gas atmosphere; and

    heating said ring of solder to melt the solder for both forming an air tight seal, and entrapping said inert gas in an interior region between the bottom of said cover glass and underlying substrate.

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