Pastes for the coating of substrates, methods for manufacturing them and their use

• US 5,723,535 A
• Filed: 10/16/1996
• Issued: 03/03/1998
• Est. Priority Date: 09/13/1993
• Status: Expired due to Term

• Current Assignee: HC Starck GmbH (OPUS Investment SARL)
• Original Assignee: HC Starck GmbH (OPUS Investment SARL)
• Inventors: Krismer, Bruno E., Hunert, Rudolf, Thies, Uwe, Ladstatter, Peter
• Primary Examiner(s): NILAND, PATRICK DENNIS
• Application Number:
  US08/733,468
• Time in Patent Office: 503 Days
• Field of Search: 106/1.13, 106/1.05, 106/640, 106/403, 106/472, 106/479, 106/480, 106/481, 252/502, 252/510, 252/511, 252/512, 252/513, 252/514, 252/515, 252/518, 252/519, 252/520, 524/401, 524/591, 524/403, 524/406, 524/413, 524/404, 524/408, 524/495, 524/496, 428/615, 427/447, 101/130, 101/453, 501/82
• US Class Current: 524/591
• CPC Class Codes: C03C 17/06 with metals C03C17/34, C03C17/44 take precedence
• CPC Class Codes: C03C 17/22 with other inorganic material C03C17/34, C03C17/44 take precedence
• CPC Class Codes: C03C 17/225 Nitrides
• CPC Class Codes: C03C 17/23 Oxides C03C17/02 takes precedence
• CPC Class Codes: C03C 2217/257 Refractory metals
• CPC Class Codes: C03C 2217/269 Non-specific enumeration
• CPC Class Codes: C03C 2217/281 Nitrides
• CPC Class Codes: C03C 2217/282 Carbides, silicides
• CPC Class Codes: C03C 2217/283 Borides, phosphides
• CPC Class Codes: C03C 2217/287 Chalcogenides
• CPC Class Codes: C03C 2218/17 from a solid phase
• CPC Class Codes: C04B 2111/00844 for electronic applications
• CPC Class Codes: C04B 2111/1006 Absence of well-defined organic compounds
• CPC Class Codes: C04B 2111/1012 Organic solvents
• CPC Class Codes: C04B 35/00 Shaped ceramic products characterised by their composition porous ceramic products C04B38/00; ceramic articles characterised by particular shape, see the relevant classes, e.g. linings for casting ladles, tundishes, cups or the like B22D41/02; ceramic substrates for microelectronic semi-conductors H01L23/15; Ceramics compositions containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides other than as macroscopic reinforcing agents C22C; shaping of ceramics B28B; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products chemical preparation of powders of inorganic compounds C01; infiltration of sintered ceramic preforms with molten metal C04B41/51
• CPC Class Codes: C04B 41/009 characterised by the material treated
• CPC Class Codes: C04B 41/4539 as a emulsion, dispersion or suspension
• CPC Class Codes: C04B 41/46 with organic materials
• CPC Class Codes: C04B 41/4884 Polyurethanes; Polyisocyanates
• CPC Class Codes: C04B 41/502 Water
• CPC Class Codes: C04B 41/5025 : with ceramic materials copper oxide or solid solutions thereof C04B41/5074
• CPC Class Codes: C04B 41/5089 : Silica sols, alkyl, ammonium or alkali metal silicate cements
• CPC Class Codes: C04B 41/51 : Metallising , e.g. infiltration of sintered ceramic preforms with molten metal covering materials with metals in general C23C; ceramic compositions containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides, other than as macroscopic reinforcing agents C22C; infiltration of preforms containing free metal, e.g. cermets C22C
• CPC Class Codes: C04B 41/5188 : organic
• CPC Class Codes: C04B 41/81 : Coating or impregnation
• CPC Class Codes: C04B 41/88 : Metals
• CPC Class Codes: C23C 10/28 : using solids, e.g. powders, pastes
• CPC Class Codes: C23C 24/08 : by application of heat or pressure and heat C23C24/04 takes precedence
• CPC Class Codes: C23C 26/00 : Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: C23C 8/60 : using solids, e.g. powders, pastes using liquid suspensions of solids C23C8/40
• CPC Class Codes: H01B 1/02 : mainly consisting of metals or alloys
• CPC Class Codes: H01B 1/04 : mainly consisting of carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01B 1/06 : mainly consisting of other non-metallic substances
• CPC Class Codes: H01B 1/08 : oxides
• CPC Class Codes: H01B 3/10 : metallic oxides ceramics H01B3/12
• CPC Class Codes: H01B 3/12 : ceramics
• CPC Class Codes: H01L 23/49883 : the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/092 : Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: Y10T 428/12493 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Abstract

The present invention relates to pastes for the coating of substrates, consisting of powdery materials present in liquid dispersion from the group of the metals, metal compounds and/or metal alloys and/or boron and/or carbon, methods for manufacturing them and their use.

Claims

1. Metallization paste and comprising:

(a) as a first dispersed solid component 50-90 weight percent of powders selected from the group consisting of Nb, Ta, Mo, W, Cr, Re, Au, Ag, Pt, Pd, Fe, Ni, C, B, Co, Mo and Ti,

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of an associative thickener in the form of a water emulsion with an active ingredient selected from the group consisting of tolulene diisocyanates (TDI) diphenylmethane diisocyanates (MDI), isophorone diisocyanates (IPDI), and hexamethylene diisocyanates (HDI),

(c) balance essentially water, and wherein

(d) the paste is printable.

4. Paste in accordance with any of claims 1, 2 or 3 and comprising as a further component (b'"'"') a silicic acid dispersion in water, as 0.1 to 1.0 weight percent calculated as SiO₂ and referred to the solids content of the paste.

2. Paste and comprising:

(a) as a first dispersed component 50-90 weight percent of chemical compound or alloy powders selected from the group consisting of niobium oxide, tantalum oxide, molybdenum oxide, tungsten oxide, zirconium oxide, indium-tin oxide, rare earth oxides, tantalates, niobates, titanium nitride, aluminum nitride, boron nitride, aluminum boride, rare earth borides and chalcogenides,

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of an associative thickener in the form of a water emulsion with an active ingredient selected from the group consisting of tolulene diisocyanates (TDI) diphenylmethane diisocyanates (MDI), isophorone diisocyanates (IPDI), and hexamethylene diisocyanates (HDI),

(c) balance essentially water, and wherein

(d) the paste is printable.

3. Silicide paste and comprising:

(a) as a first dispersed component 50-90 weight percent of silicide powders selected from the group consisting of molybdenum silicide and tungsten silicide

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of an associative thickener in the form of a water emulsion with an active ingredient selected from the group consisting of tolulene diisocyanates (TDI) diphenylmethane diisocyanates (MDI), isophorone diisocyanates (IPDI), and hexamethylene diisocyanates (HDI),

(c) balance essentially water, and wherein

(d) the paste is printable.

5. Metallization paste which is formed and processable without use of organic solvents and comprising:

(a) as a first dispersed solid component 50-90 weight percent of powders selected from the group consisting of Nb, Ta, Mo, W, Cr, Re, Au, Ag, Pt, Pd, Fe, Ni, C, B, Co, Mo and Ti.

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of a water soluble associative polyurethane

(c) balance essentially water, and wherein

(d) the paste is printable and also able to substantially liberate, upon heating, all thickener and organics content thereof.

8. Pastes according to any of claims 5-7, characterized in that the paste has a solids content of 50 to 90 wt % of the powdery materials.

9. Pastes according to any of claims 5-7, characterized in that their solids do not contain any organic residual substances after a heat treatment up to 550°

C.

10. Pastes according to any of claims 5-7, characterized in that the pastes are metallization pastes, wherein the powdery materials are metals selected from the group consisting of niobium, tantalum, molybdenum, tungsten, rhenium, gold, silver, platinum, palladium, iron, cobalt, nickel and titanium.

11. Pastes according to any of claims 5-7, characterized in that the pastes are dielectric pastes, wherein the powdery materials are selected from the group consisting of refractory metal oxides, niobates, tantalates and titanates.

12. Pastes according to any of claims 5-7, characterized in that the pastes are silicide pastes.

13. Pastes according to claim 12 wherein the silicides are selected from the group consisting of molybdenum silicide and tungsten silicide.

14. Method for manufacturing the pastes according to any of claims 5-7, characterized in that the powdery materials are dispersed in water and are mixed with the associative thickeners.

15. Method of using the pastes made according to any of claims 5-7 for the coating of substrates by printing techniques.

16. Method according to claim 15 wherein the printing technique is screen printing.

17. Method according to claim 15 wherein the printing technique is lithography.

18. A coated substrate comprising a substrate coated with a paste made as in any of claims 5-7 and characterized in that the coating can be heated to 550°

C. and then be essentially free of organic residual substances.

19. Coated substrate according to claim 18 wherein the powder particles are sintered to bond to each other and the substrate.

6. Paste which is formed and processable without use of organic solvents and comprising:

(a) as a first dispersed component 50-90 weight percent of chemical compound or alloy powders selected from the group consisting of niobium oxide, tantalum oxide, molybdenum oxide, tungsten oxide, zirconium oxide, indium-tin oxide, rare earth oxides, tantalates, niobates, titanium nitride, aluminum nitride, boron nitride, aluminum boride, rare earth borides and chalcogenides,

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of a water soluble associative polyurethane,

(c) balance essentially water, and wherein

(d) the paste is printable and also able to substantially liberate, upon heating, all thickener and organics content thereof.

7. Silicide paste which is formed and processable without use of organic solvents and comprising:

(a) as a first dispersed component 50-90 weight percent of silicide powders selected from the group consisting of molybdenum silicide and tungsten silicide

(b) as a second component, 0.2 to 20 weight percent, referred to solids content, of a water soluble associative polyurethane,

(c) balance essentially water, and wherein

(d) the paste is printable and also able to substantially liberate, upon drying, all thickener and organics content thereof.