Structure for providing an electrical connection between circuit members

• US 5,723,894 A
• Filed: 07/03/1996
• Issued: 03/03/1998
• Est. Priority Date: 07/07/1995
• Status: Expired due to Term

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Ueno, Toshiaki, Saito, Mitsuchika
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/675,768
• Time in Patent Office: 608 Days
• Field of Search: 257/777, 257/420, 257/418, 257/415, 257/692, 257/774, 257/780
• US Class Current: 257/415
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An electrical connection structure interconnects a first circuit member and a second circuit member and comprises a cantilever, a conductive needle, a terminal pad and a fixing element. The cantilever is formed in the semiconductor substrate and has an end remote from the semiconductor substrate. The conductive needle is at the end of the cantilever and is electrically connected to the first circuit member. The terminal pad is located on the second circuit member opposite the conductive needle tip when the first circuit member and the second circuit member are juxtaposed. The terminal pad is electrically connected to the second circuit member. The fixing element fixes the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad.

Claims

1. An electrical connection structure for connecting a first circuit member to a second circuit member, the first circuit member including a semiconductor substrate, the electrical connection structure comprising:

a cantilever formed in the semiconductor substrate, the cantilever having an end remote from the semiconductor substrate;

a conductive needle at the end of the cantilever, the conductive needle being electrically connected to the first circuit member;

a terminal pad located on the second circuit member opposite the conductive needle when the first circuit member and the second circuit member are juxtaposed, the terminal pad being electrically connected to the second circuit member; and

fixing means for fixing the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad.

2. The electrical connection structure of claim 1, in which:

the second circuit member is a circuit substrate;

the first circuit member is one of plural semiconductor chips;

each of the semiconductor chips includes a semiconductor substrate in which a cantilever is formed; and

the electrical connection structure additionally includes a terminal pad located on the second circuit member opposite the conductive needle of the cantilever in each of the semiconductor chips.

3. The electrical connection structure of claim 2, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

4. The electrical connection structure of claim 1, additionally comprising electrostatic electrode means, attached to the cantilever and at least one of the first circuit member and the second circuit member, for applying flexural stress to the cantilever.

5. The electrical connection structure of claim 4, additionally comprising control means for applying a voltage to the electrostatic drive electrode means to change the contact force between the conductive needle and the terminal pad.

6. The electrical connection structure of claim 5, in which the control means is additionally for applying a voltage to the electrostatic drive electrode means to break contact between the conductive needle and the terminal pad.

7. The electrical connection structure of claim 4, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

8. The electrical connection structure of claim 4, additionally comprising plural conductive needles contacting the terminal pad, the plural conductive needles being located at the end of at least one cantilever.

9. The electrical connection structure of claim 4, in which:

the first circuit member and the second circuit member are generally planar; and

electrical connection structure additionally comprises positioning means, located on at least one of the first circuit member and the second circuit member, for defining a relative positioning between the first circuit member and the second circuit member at least in a direction perpendicular to the plane of the circuit members.

10. The electrical connection structure of claim 4, in which the fixing means is for temporarily holding the first circuit member juxtaposed to the second circuit member to allow the first circuit member to be removed from and re-installed in the second circuit member.

11. The electrical connection structure of claim 1, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

12. The electrical connection structure of claim 1, additionally comprising plural conductive needles contacting the terminal pad, the plural conductive needles being located at the end of at least one cantilever.

13. The electrical connection structure of claim 12, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

14. The electrical connection structure of claim 1, in which the electrical connection structure additionally comprises positioning means, located on at least one of the first circuit member and the second circuit member, for defining a relative positioning between the first circuit member and the second circuit member at least in a direction perpendicular to the substrate of the first circuit member.

15. The electrical connection structure of claim 14, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

16. The electrical connection structure of claim 1, in which the fixing means is for temporarily holding the first circuit member juxtaposed to the second circuit member to allow the first circuit member to be removed from and re-installed in the second circuit member.

17. The electrical connection structure of claim 16, in which the substrate of the first circuit member includes single-crystal silicon, and the cantilever is formed in the substrate by silicon micro machining.

18. An electrical connection structure for connecting a first circuit member to a second circuit member, the electrical connection structure comprising:

a single-crystal substrate in the first circuit member;

a cantilever formed from the single-crystal substrate of the first circuit member by micromachining, the cantilever having an end remote from the semiconductor substrate;

a conductive needle at the end of the cantilever, the conductive needle being electrically connected to the first circuit member;

a terminal pad located on the second circuit member opposite the conductive needle when the first circuit member and the second circuit member are juxtaposed, the terminal pad being electrically connected to the second circuit member;

positioning means, located on at least one of the first circuit member and the second circuit member, for defining a relative positioning between the first circuit member and the second circuit member a direction perpendicular to the substrate of the first circuit member; and

fixing means for fixing the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad.

19. The electrical connection structure of claim 18, in which the positioning means is additionally for defining the relative positioning between the first circuit member and the second circuit member a direction parallel to the substrate of the first circuit member.

20. An electrical connection structure for connecting a first circuit member to a second circuit member, the electrical connection structure comprising:

a single-crystal substrate in the first circuit member;

a cantilever formed in the single-crystal substrate of the first circuit member, the cantilever having an end remote from the semiconductor substrate;

a conductive needle at the end of the cantilever, the conductive needle being electrically connected to the first circuit member;

a terminal pad located on the second circuit member opposite the conductive needle when the first circuit member and the second circuit member are juxtaposed, the terminal pad being electrically connected to the second circuit member;

fixing means for fixing the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad, and

electrostatic electrode means, attached to the cantilever and at least one of the first circuit member and the second circuit member, for applying flexural stress to the cantilever in response to a voltage.