Inspecting apparatus of mounted component

• US 5,724,439 A
• Filed: 06/09/1994
• Issued: 03/03/1998
• Est. Priority Date: 06/10/1993
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Tsujikawa, Toshihiko, Mizuoka, Seiji, Ueda, Youichiro, Okamoto, Kenji, Ikurumi, Kazuhiro, Yasutake, Masanori
• Primary Examiner(s): Boudreau, Leo
• Assistant Examiner(s): KELLEY, CHRISTOPHER S
• Application Number:
  US08/257,382
• Time in Patent Office: 1,363 Days
• Field of Search: 382/145, 382/147, 382/149, 382/150, 382/162, 382/165, 348/87, 348/126, 348/129, 348/130, 356/237
• US Class Current: 382/149
• CPC Class Codes: G06T 2207/10024 Color image
• CPC Class Codes: G06T 2207/30141 Printed circuit board [PCB]
• CPC Class Codes: G06T 7/0004 Industrial image inspection

Abstract

A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

Claims

1. An inspecting apparatus for inspecting a mounting state of a component mounted on a printed circuit board with adhesive, comprising:

an image pick-up unit for picking up in colors an image of the board after the component is mounted;

a color extracting part for discriminating a portion of the image depicting the adhesive based on a predetermined color distribution of the adhesive and then extracting the thus discriminated adhesive portion of the image as extracted data;

an image cutting part for setting a window frame defining a to-be-inspected portion in the image of the board, and extracting a portion of the image within said window frame as window frame data; and

a deciding part for deciding, based on the extracted data and the window frame data, whether the mounting state of the component includes an unacceptable bulging of the adhesive according to a size or an area of the adhesive portion of the image within the window frame of the image which exhibits a color within the predetermined color distribution of the adhesive;

wherein the component includes at least one electrode, and wherein the window frame is set around a detected position of the at least one electrode;

wherein the deciding part discriminates the presence of unacceptable bulging of the adhesive when the size or area of the adhesive portion of the image within the window frame exceeds a preset value and discriminates the absence of unacceptable bulging of the adhesive when the size or area of the adhesive portion in the window frame does not exceed the preset value.

2. An inspecting apparatus for inspecting a mounting state of a component mounted on a printed circuit board with adhesive, comprising:

an image pick-up unit for picking up in colors an image of the board after the component is mounted;

a color extracting part for discriminating any portion of the image depicting the adhesive based on a predetermined color distribution of the adhesive and then extracting the thus discriminated adhesive portion of the image as extracted data;

an image cutting part for setting a window frame defining a to-be-inspected portion in the image of the board, and extracting a portion of the image within said window frame as window frame data;

a deciding part for deciding, based on the extracted data and the window frame data, whether the mounting state of the component includes an unacceptable bulging of the adhesive according to a size or an area of the adhesive portion of the image within the window frame of the image which exhibits a color within the predetermined color distribution of the adhesive;

wherein the window frame is set around a land of the printed circuit board; and

wherein the deciding part discriminates the presence of unacceptable bulging of the adhesive when the size or area of the adhesive portion of the image within the window frame exceeds a preset value and discriminates the absence of unacceptable bulging of the adhesive when the size or area of the adhesive portion in the window frame does not exceed the preset value.