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Thermoelectric cooling module and method for manufacturing the same

  • US 5,724,818 A
  • Filed: 07/25/1996
  • Issued: 03/10/1998
  • Est. Priority Date: 07/27/1995
  • Status: Expired due to Fees
First Claim
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1. A thermoelectric cooling module, in which a solid electronic device required to have temperature stability is cooled due to the Peltier effect of P-type and N-type thermoelectric semiconductor elements, comprising:

  • a heat radiating section comprising a heat radiating electrode having a fin-shaped portion for heat radiation integrally formed;

    a heat absorbing section comprising a heat absorbing electrode having a contacting surface contacted directly with said electric device; and

    a thermoelectric conversion section comprising said P-type and N-type thermoelectric semiconductor elements interposed between and electrically connected by said heat radiating section and said heat absorbing section.

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