Adhesive polyimide siloxane composition employable for combining electronic parts

• US 5,728,473 A
• Filed: 11/20/1995
• Issued: 03/17/1998
• Est. Priority Date: 11/18/1994
• Status: Expired due to Term

• Current Assignee: UBE Industries Limited
• Original Assignee: UBE Industries Limited
• Inventors: Sonoyama, Kenji, Muramatu, Tadao, Inoue, Hiroshi, Takabayashi, Seiichirou
• Primary Examiner(s): NAKARANI, DHIRAJLAL S
• Application Number:
  US08/559,607
• Time in Patent Office: 848 Days
• Field of Search: 428/450, 428/473.5, 428/447, 428/448, 428/458
• US Class Current: 428/448
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

An adhesive polyimide composition comprises 100 weight parts of a polyimide siloxane having a Tg of not lower than 200° C. and 0.2 to 5 weight parts of a silane coupling agent having a glycidyl group. An epoxy resin may be incorporated into the polyimide composition. The polyimide siloxane is prepared by polymerization reaction of an aromatic tetracarboxylic acid dianhydride or its derivative and a diamine composition comprising 5 to 25 mol. % of a specific diaminosiloxane and 75 to 95 mol. % of an aromatic diamine having at least two benzene rings and one oxygen atom intervening these benzene rings. The adhesive polyimide composition is generally employed in the form of a solution in an organic solvent and for combining electrically conductive or insulating members.

Claims

1. A composite comprising two substrates and a polyimide composition layer intervening between these substrates, in which one substrate is an aromatic polyimide film and another substrate is material selected front the group consisting of an aromatic polyimide film, a silicon plate, a copper film and a polyimide siloxane film, and the polyimide composition layer is made of an adhesive polyimide composition having a water absorption of not more than 1 wt. % and comprising:

100 weight parts of a polyimide siloxane having a glass transition temperature of not lower than 200°

C., said polyimide siloxane being prepared from an aromatic tetracarboxylic acid dianhydride or its free acid or ester derivative and a diamine composition comprising 5 to 25 mol. % of a diaminosiloxane having the formula (I);

##STR2## wherein R is a divalent hydrocarbon residue, each of R¹, R², R³, R⁴ independently is an alkyl group of 1 to 5 carbon atoms or phenyl, and k is an integer of 0 to 30, and 75 to 95 mol. % of an aromatic diamine having the formula (II)

space="preserve" listing-type="equation">H.sup.2 H--R.sup.5 --NH.sub.2 (II)

wherein R⁵ represents one of the formulas of Bz--O--Bz and Bz--O--X--O--Bz, wherein Bz means a benzene ring and X represents Bz or Bz--Y--Bz, wherein Y is SO₂, O, CH₂ or C(CH₃)₂ ; and

3. A composite according to claim 1, in which the aromatic polyimide film is made of an aromatic polyimide prepared from 3,3'"'"',4,4'"'"'-biphenyltetracarboxylic acid anhydride and p-phenylenediamine.

4. A composite according to claim 1, in which the aromatic polyimide film has a surface having been subjected to no surface activating treatment.

5. A composite according to claim 1, in which the adhesive polyimide composition further comprises 0.1 to 30 weight parts of an epoxy resin.

6. A composite according to claim 1, wherein the aromatic tetracarboxylic acid dianhydride or its derivative is 2,3,3'"'"',4'"'"'-biphenyltetracarboxylic acid dianhydride or its derivative.

7. A composite according to claim 1, wherein the silane coupling agent is γ

-glycidoxypropyltrimethoxysilane or γ

-glycidoxypropylmethyldiethoxysilane.

2. 2 to 5 weight parts of a silane coupling agent having a glycidyl group.