Method of manufacturing an optical device

• US 5,728,509 A
• Filed: 06/06/1995
• Issued: 03/17/1998
• Est. Priority Date: 06/21/1991
• Status: Expired due to Fees

• Current Assignee: Mitsui Chemicals Incorporated (Mitsui Chemicals)
• Original Assignee: Mitsui Petrochemical Industries, Ltd.
• Inventors: Muro, Kiyofumi, Eda, Akira
• Primary Examiner(s): McPherson, John A.
• Application Number:
  US08/470,273
• Time in Patent Office: 1,015 Days
• Field of Search: 430/321, 430/323, 430/396, 430/330, 216/24, 216/26
• US Class Current: 430/321
• CPC Class Codes: G02B 3/0012 characterised by the manufacturing method
• CPC Class Codes: G02B 3/0018 Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
• CPC Class Codes: G02B 3/005 arranged along a single direction only, e.g. lenticular sheets G02B3/0043 takes precedence
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G02B 3/0068 arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements G02B5/1885, G02B17/002, G02B30/27 take precedence
• CPC Class Codes: G02B 6/1245 Geodesic lenses
• CPC Class Codes: G02F 1/37 for second-harmonic generation G02F1/3532 takes precedence
• CPC Class Codes: G03F 7/0005 Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
• CPC Class Codes: H01S 3/0606 with polygonal cross-section, e.g. slab, prism H01S3/0604 takes precedence
• CPC Class Codes: H01S 3/0615 Shape of end-face
• CPC Class Codes: H01S 3/0621 Coatings on the end-faces, e.g. input/output surfaces of the laser light
• CPC Class Codes: H01S 3/0625 Coatings on surfaces other than the end-faces
• CPC Class Codes: H01S 3/0627 the resonator being monolithic, e.g. microlaser
• CPC Class Codes: H01S 3/08095 Zig-zag travelling beam through the active medium
• CPC Class Codes: H01S 3/09415 the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
• CPC Class Codes: H01S 3/2308 Amplifier arrangements, e.g. MOPA
• CPC Class Codes: H01S 3/2383 Parallel arrangements
• CPC Class Codes: H01S 5/0267 Integrated focusing lens H01S5/18388 takes precedence
• CPC Class Codes: H01S 5/18388 Lenses

Abstract

At least one convex (or concave) arcuate face is formed by photolithography on a photoresist film formed on a surface of an optical device made of an optical material. The surface of the optical device and the photoresist film are etched to form, on the surface of the optical device, at least one convex (or concave) arcuate face similar to the convex (or concave) arcuate face formed on the photoresist film. After the surface of the optical material is mirror face polished, a photoresist film is formed on the polished surface, and the polished surface and the photoresist film are etched uniformly. An optical device obtained in this manner is used for a laser oscillator, a monolithic laser system, a nonlinear optical device, a microlens, a ring laser and so forth. Further, a plurality of reflecting portions are provided on a pair of opposing surfaces of a light transmitting optical material. At least one of the opposing surfaces is formed on the convex arcuate face. A zigzag optical path is formed between the reflecting portions of the opposing faces of the light transmitting optical material such that it couples the reflecting portions alternately to each other, thereby to obtain an optical device having a long optical path. The optical device is employed as a higher harmonic wave converting device, highly efficient for a short wavelength laser apparatus.

Claims

1. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on a face of a body of an optical device which includes a non-linear optical material, the face being substantially flat;

exposing the photoresist to a light of a circular or elliptic pattern, whose intensity varies gradually or stepwise from a center toward an outer periphery of the pattern;

developing the photoresist thereby forming a convex arcuate photoresist pattern on the face of the body in a direction perpendicular to the face of the body;

etching the face of the body and the photoresist pattern so that a convex arcuate portion is formed on the face of the body which follows a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the face of the body being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature.

2. The method of claim 1, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern using a lens of a low resolution as an exposure lens, and the light of the circular or elliptic pattern is formed on the photoresist using a mask, thereby effecting exposure of the photoresist.

3. The method of claim 1, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern such that an image of the circular or elliptic pattern to be formed on the photoresist is formed on the photoresist in a defocused condition to effect exposure of the photoresist.

4. The method of claim 1, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern using a mask on which the pattern is formed, the mask has a black circular or elliptic shape which varies in photographic density from a central portion toward an outer periphery thereof, and wherein an image of the mask is formed on the photoresist using the mask as a negative for transfer of the circular or elliptic shape.

5. The method of claim 1, wherein the exposing step uses a mask spaced from the photoresist to form the pattern on the photoresist.

6. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on a face of a body of an optical device which includes a non-linear optical material, the face being substantially flat;

exposing the photoresist to a light of a circular or elliptic pattern;

developing the photoresist to form a circular column or an elliptic column photoresist pattern;

heating the photoresist pattern to deform the photoresist pattern such that the photoresist pattern obtains a convex arcuate shape in a direction perpendicular to the face;

etching the face of the body and the photoresist pattern so that a convex arcuate portion is formed on the face of the body which follows a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the face of the body being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature.

7. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on one of a first face and a second face of a body of optical material, the first face opposing the second face;

exposing the photoresist to a light of at least one circular or elliptic pattern whose intensity is varied gradually or stepwise from a center toward an outer periphery of the pattern;

developing the photoresist thereby forming a convex arcuate photoresist pattern on the one of the first and second face in a direction perpendicular to the arc of the first and second face;

etching the photoresist pattern and the one of the first and second face having the photoresist pattern formed thereon so that a convex arcuate portion is formed on the one of the first and second face, the convex arcuate portion following a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the one of the first and second face having the photoresist pattern formed thereon being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature; and

coating a reflecting dielectric film on portions on at least one of the first and the second faces to form reflecting portions, the convex arcuate portion being coated to form one of the reflecting portions.

8. The method of claim 7, wherein the step of coating the reflecting film includes the sub-steps of:

coating a photoresist film on one of the first and the second face,

exposing the photoresist film to light through a mask having reflecting portion patterns formed thereon,

developing the photoresist film,

coating the reflecting film on the one of the first and second face having the developed photoresist film disposed thereon, and

removing the developed photoresist film.

9. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on one of a first face and a second face of a body of optical material, the first face opposing the second face;

exposing the photoresist to a light of a circular or elliptic pattern;

developing the photoresist to form a circular or elliptic column photoresist pattern;

heating the photoresist pattern so that the photoresist pattern is deformed and a thickness of the photoresist pattern gradually decreases from a center toward an outer periphery of the photoresist pattern;

etching the photoresist pattern and the one of the first and second face having the photoresist pattern formed thereon so that a convex arcuate portion is formed on the one of the first and second face, the convex arcuate portion following a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the one of the first and second face having the photoresist pattern formed thereon being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature; and

coating a reflecting dielectric film on portions on at least one of the first and second faces to form reflecting portions, the convex arcuate portion being coated to form one of the reflecting portions.

10. The method of claim 9, wherein the step of coating the reflecting film includes the sub-steps of:

coating a photoresist film on one of the first and the second face,

exposing the photoresist film to light through a mask having reflecting portion patterns formed thereon,

developing the photoresist film,

coating the reflecting film on the one of the first and second face having the developed photoresist film disposed thereon, and

removing the developed photoresist film.

11. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on a face of a body of a laser medium, the face being substantially flat;

exposing the photoresist to a light of a circular or elliptic pattern, whose intensity varies gradually or stepwise from a center toward an outer periphery of the pattern;

developing the photoresist thereby forming a convex arcuate photoresist pattern on the face of the body in a direction perpendicular to the face of the body;

etching the face of the body and the photoresist pattern so that a convex arcuate portion is formed on the face of the body which follows a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the face of the body being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature.

12. The method of claim 11, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern using a lens of a low resolution as an exposure lens, and the light of the circular or elliptic pattern is formed on the photoresist using a mask, thereby effecting exposure of the photoresist.

13. The method of claim 11, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern such that an image of the circular or elliptic pattern to be formed on the photoresist is formed on the photoresist in a defocused condition to effect exposure of the photoresist.

14. The method of claim 11, wherein in the exposing step, the intensity of the light is varied gradually or stepwise from the center toward the outer periphery of the pattern using a mask on which the pattern is formed, the photomask has a black circular or elliptic shape which varies in photographic density from a central portion toward an outer periphery thereof, and wherein an image of the photomask is formed on the photoresist using the photomask as a negative for transfer of the circular or elliptic shape.

15. A method of manufacturing an optical device, said method comprising the steps of:

coating a photoresist on a face of a body of a laser medium, the face being substantially flat;

exposing the photoresist to a light of a circular or elliptic pattern;

developing the photoresist to form a circular column or an elliptic column photoresist pattern;

heating the photoresist pattern to deform the photoresist pattern such that the photoresist pattern obtains a convex arcuate shape in a direction perpendicular to the face;

etching the face of the body and the photoresist pattern so that a convex arcuate portion is formed on the face of the body which follows a cross-section shape of the photoresist pattern, an etching ratio between the photoresist pattern and the face of the body being adjusted during etching by varying an ion accelerating voltage to obtain said convex arcuate portion having a desired radius of curvature.