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Circuit encapsulation process

  • US 5,728,600 A
  • Filed: 11/15/1994
  • Issued: 03/17/1998
  • Est. Priority Date: 11/15/1994
  • Status: Expired due to Term
First Claim
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1. A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprisinginserting the substrate into a mold,closing a top of the mold and a bottom of the mold against the substrate,pushing molding compound from a conduit having a top defined by the substrate into a chamber in the mold, andencapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads.

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