Apparatus and method for flat circuit assembly

• US 5,729,053 A
• Filed: 07/03/1996
• Issued: 03/17/1998
• Est. Priority Date: 07/27/1994
• Status: Expired due to Fees

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Orthmann, Kurt
• Primary Examiner(s): MONIN, DONALD L JR
• Application Number:
  US08/676,876
• Time in Patent Office: 622 Days
• Field of Search: 257/684, 257/723, 257/724, 257/727, 257/924, 257/532, 257/535, 174/52, 361/820
• US Class Current: 257/724
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4809 Loop shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/184 : Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09981 : Metallised walls
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10636 : Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 257/924 : with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Abstract

A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.

Claims

1. A batteryless flat integrated circuit assembly, comprising:

at least one integrated circuit;

a capacitor;

a carrier having a thickness less than that of the integrated circuit and capacitor, said carrier defining shallow cavities for accommodating each of said integrated circuit and capacitor; and

electrical connectors connecting said at least one integrated circuit and capacitor.

2. The assembly, as set forth in claim 1, further comprising an adhesive securing said integrated circuit and capacitor in said shallow cavities.

3. The assembly, as set forth in claim 1, further comprising a solder securing said integrated circuit and circuit component in said shallow cavities.

4. The assembly, as set forth in claim 1, wherein said cavities are properly sized to friction fit said integrated circuit and circuit component.

5. The assembly, as set forth in claim 1, wherein said electrical connectors include metallic caps formed in said carrier, disposed around an opening of said cavity and intimately contacting terminals of said circuit component.

6. The assembly, as set forth in claim 5, further comprising a conductive adhesive disposed at an interface between said metallic caps and circuit component terminals.

7. The assembly, as set forth in claim 1, wherein said electrical connectors include wires.

8. The assembly, as set forth in claim 1, wherein said electrical connectors include ribbons.

9. The assembly, as set forth in claim 1, wherein said electrical connectors include a flexible substrate with conducting lμ

meads.

10. The assembly, as set forth in claim 1, wherein the assembly height does not exceed 760 μ

m.

11. A method of assembly of integrated circuits and circuit components to not exceed 760 μ

m package thickness, comprising the steps of;

preparing a carrier of between 200 and 400 μ

m by defining a cavity of appropriate size and dimensions for each of said integrated circuits and circuit components;

positioning and securing said integrated circuits and circuit components in said respective cavities; and

electrically connecting said integrated circuits and circuit components.

12. The assembly method, as set forth in claim 11, wherein said positioning and securing step includes the steps of:

dispensing an adhesive in said cavities prior to positioning said integrated circuits and circuit components therein; and

curing said adhesive.

13. The assembly method, as set forth in claim 12, wherein said adhesive includes solder.

14. The assembly method, as set forth in claim 11, further comprising the steps of:

applying an adhesive to said integrated circuits and circuit components and carrier after said positioning step; and

curing said adhesive.

15. The assembly method, as set forth in claim 14, wherein said adhesive includes solder.

16. The assembly method, as set forth in claim 11, wherein said electrically connecting step includes the step of wire bonding.

17. The assembly method, as set forth in claim 11, wherein said electrically connecting step includes the step of ribbon bonding.

18. The assembly method, as set forth in claim 11, further comprising the steps of:

forming conductive leads on said carrier and extending from said cavity; and

positioning a circuit component in said cavity where terminals thereof intimately contact said conductive leads.

19. The assembly method, as set forth in claim 18, wherein said conductive lead forming step includes the step of forming said conductive leads on at least a portion of vertical walls of said cavity.

20. The assembly method, as set forth in claim 18, further comprising the step of dispensing a conductive adhesive at an interface between said conductive leads and said terminals.

21. The assembly method, as set forth in claim 18, further comprising the step of dispensing a solder at an interface between said conductive leads and said terminals.

22. The assembly method, as set forth in claim 18, further comprising the step of forming a conductive bond at an interface between said conductive leads and said terminals.