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Electronic part including a thin body of molding resin

  • US 5,729,437 A
  • Filed: 06/06/1995
  • Issued: 03/17/1998
  • Est. Priority Date: 06/22/1994
  • Status: Expired due to Term
First Claim
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1. An electronic part of a leadless package type comprising:

  • a rectangular substrate having a top surface and a periphery and provided along the periphery with a plurality of through holes that extend to the top surface and with a plurality of external electrodes which extend along said through holes;

    an element part placed on the top surface of said substrate and electrically connected to said external electrodes;

    a body of molding resin molded around said element part and to said top surface of said substrate; and

    a flow preventing member covering at least a portion of said through holes for preventing flow of molding resin into the portion of said through holes;

    wherein said molding resin is a material having low thixotropy, said body of molding resin has an upper surface which is coextensive with, and faces away from, said substrate and side surfaces which are coextensive with the periphery of said substrate, the entirety of said upper surface of said body of molding resin is flat, and the entirety of said side surfaces of said body of molding resin is flush with the entire periphery of said substrate.

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