Application of diamond-like carbon coatings to cobalt-cemented tungsten carbide components

• US 5,731,045 A
• Filed: 01/26/1996
• Issued: 03/24/1998
• Est. Priority Date: 01/26/1996
• Status: Expired due to Fees

• Current Assignee: Southwest Research Institute
• Original Assignee: Southwest Research Institute
• Inventors: Dearnaley, Geoffrey, Lankford, James Jr.
• Primary Examiner(s): King, Roy V.
• Application Number:
  US08/592,077
• Time in Patent Office: 788 Days
• Field of Search: 427/525, 427/527, 427/249, 427/523, 427/122, 427/402, 427/2.26
• US Class Current: 427/527
• CPC Class Codes: C22C 29/08 based on tungsten carbide
• CPC Class Codes: C23C 16/0263 Irradiation with laser or particle beam
• CPC Class Codes: C23C 16/0272 Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• CPC Class Codes: C23C 16/26 Deposition of carbon only
• CPC Class Codes: C23C 26/00 Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: C23C 28/04 only coatings of inorganic non-metallic material
• CPC Class Codes: C23C 30/005 on hard metal substrates

Abstract

The present invention uses ion beam assisted deposition to adhere a diamond-like carbon coating to a cobalt-cemented tungsten carbide substrate, resulting in the following gradient at the surface of the substrate: substrate/(metal-silicide or metal-germanide)/(silicon or germanium)/(silicon carbide or germanium carbide)/DLC.

Claims

1. A method for adhering a coating of diamond-like carbon to a cobalt-cemented tungsten carbide substrate comprising:

exposing said substrate to a vacuum of at least about 10^-5 torr;

heating said substrate to a first temperature between about 200 °

-600°

C. (392°

-1112°

F.);

depositing an intermediate material selected from the group consisting of silicon and germanium onto said substrate in an amount sufficient to form an intermetallic bonding layer cohesively bonded to an interlayer of said intermediate material;

substantially simultaneously bombarding said interlayer with a first energetic beam of ions at a first energy, a first ion arrival ratio, and for a first amount of time sufficient to form said intermetallic bonding layer cohesively bonded to said interlayer;

condensing a diamond-like carbon precursor onto said interlayer at a second temperature and for a second amount time sufficient to form a film of said precursor molecules on said interlayer;

substantially simultaneously bombarding said diamond-like carbon precursor with a second energetic beam of ions at a second energy, a second ion arrival ratio, and a for third amount of time sufficient to form a carbide bonding layer cohesively bonded to an outer coating of diamond-like carbon.

2. The process of claim 1 wherein said first and second energetic beam of ions comprise ions selected from the group consisting of nitrogen, argon, silicon, methane, helium, neon, or combinations thereof.

3. The process of claim 1 wherein said second energetic beam of ions comprises nitrogen ions.

4. The process of claim 1 wherein said first and second energy of said first and second energetic beam of ions is between about 1-100 keV.

5. The process of claim 1 wherein said first and second energy of said first and second energetic beam of ions is between about 5-30 keV.

6. The process of claim 2 wherein said first and second energy of said first and second energetic beam of ions is between about 1-100 keV.

7. The process of claim 2 wherein said first and second energy of said first and second energetic beam of ions is between about 5-30 keV.

8. The process of claim 3 wherein said first and second energy of said first and second energetic beam of ions is between about 1-100 keV.

9. The process of claim 3 wherein said first and second energy of said first and second energetic beam of ions is between about 5-30 keV.

10. The process of claim 1 wherein

said intermediate material is deposited onto said substrate to a thickness of between about 100-200 nm;

and,

said first ion arrival ratio is about 1 ion to about 10 atoms of said intermediate material.

11. The process of claim 3 wherein

said intermediate material is deposited onto said substrate to a thickness of between about 100-200 nm;

and,

said first ion arrival ratio is about 1 ion to about 10 atoms of said intermediate material.

12. The process of claim 4 wherein

said intermediate material is deposited onto said substrate to a thickness of between about 100-200 nm;

and,

said first ion arrival ratio is about 1 ion to about 10 atoms of said intermediate material.

13. The process of claim 5 wherein

said intermediate material is deposited onto said substrate to a thickness of between about 100-200 nm;

and,

said first ion arrival ratio is about 1 ion to about 10 atoms of said intermediate material.

14. The process of claim 9 wherein

said intermediate material is deposited onto said substrate to a thickness of between about 100-200 nm;

and,

said first ion arrival ratio is about 1 ion to about 10 atoms of said intermediate material.

15. The method of claim 1 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

16. The method of claim 3 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

17. The method of claim 4 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

18. The method of claim 5 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

19. The method of claim 9 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

20. The method of claim 10 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).

21. The method of claim 14 wherein, prior to condensing said diamond-like carbon precursor onto said interlayer, said substrate is cooled to below about 100°

C. (212°

F.).