Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
First Claim
1. An apparatus for mounting an electronic component to a substrate, the electronic component having a die and a terminal coupled to the die, the substrate having a first side and a second side and having a passage therethrough, the terminal in communication with the first side and the die disposed within the passage, the apparatus comprising:
- a cover, the cover enclosing the die and at least a portion of the terminal, the cover having a fixed portion and a removable portion detachably connected to the fixed portion, the fixed portion comprising a connection region and an extension region, the connection region coupled to the terminal, the extension region disposed within the passage and having a surface that is substantially coplanar with the second side, the extension region and the substrate having a space therebetween;
an adhesive disposed on the surface of the extension region, at least a portion of the adhesive extending into the space; and
a sealing frame in communication with the adhesive and the second side, the sealing frame overlapping the space.
1 Assignment
0 Petitions
Accused Products
Abstract
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).
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Citations
12 Claims
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1. An apparatus for mounting an electronic component to a substrate, the electronic component having a die and a terminal coupled to the die, the substrate having a first side and a second side and having a passage therethrough, the terminal in communication with the first side and the die disposed within the passage, the apparatus comprising:
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a cover, the cover enclosing the die and at least a portion of the terminal, the cover having a fixed portion and a removable portion detachably connected to the fixed portion, the fixed portion comprising a connection region and an extension region, the connection region coupled to the terminal, the extension region disposed within the passage and having a surface that is substantially coplanar with the second side, the extension region and the substrate having a space therebetween; an adhesive disposed on the surface of the extension region, at least a portion of the adhesive extending into the space; and a sealing frame in communication with the adhesive and the second side, the sealing frame overlapping the space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification