Ultrasonic array with attenuating electrical interconnects
First Claim
1. An ultrasonic array comprising:
- (a) a plurality of ultrasonic transducers, each of the plurality of ultrasonic transducers having a matching layer/common electrode end and a driving layer/individually isolated end;
(b) a means for bump bonding each one of the plurality of ultrasonic transducers to a substrate;
(c) a high voltage electrical conductor connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the plurality of ultrasonic transducers;
(d) a conductive layer disposed to electrically connect each matching layer end; and
(e) an outer matching layer connected to the conductive layer wherein the bump bonding means is constructed of a size so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.
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Accused Products
Abstract
An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.
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Citations
28 Claims
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1. An ultrasonic array comprising:
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(a) a plurality of ultrasonic transducers, each of the plurality of ultrasonic transducers having a matching layer/common electrode end and a driving layer/individually isolated end; (b) a means for bump bonding each one of the plurality of ultrasonic transducers to a substrate; (c) a high voltage electrical conductor connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the plurality of ultrasonic transducers; (d) a conductive layer disposed to electrically connect each matching layer end; and (e) an outer matching layer connected to the conductive layer wherein the bump bonding means is constructed of a size so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An adaptive ultrasound array comprising:
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(a) an array of ultrasonic transducers having a first plurality of receivers and a second plurality of transmitters having a signal; (b) means for switching each one of the first plurality of receivers and each one of the second plurality of transmitters connected to the signal having a receive signal and a transmit signal; and (c) means for scanning the array of ultrasonic transducers to select at least one receiver from the plurality of receivers and to select at least one transmitter from the plurality of transmitters that provide a useable signal having a signal to noise ratio above a predetermined value; and (d) means for processing the receive signal and transmit signal from the at least one selected receiver and the at least one transmitter to adaptively process the receive signal and transmit signal. - View Dependent Claims (22, 23)
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24. A method for operating an adaptive ultrasonic array comprising the steps of:
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(a) transmitting an ultrasonic pulse from the adaptive ultrasonic array to a target; (b) receiving a first peak return pulse from the target with the adaptive ultrasonic array; (c) receiving a second peak return pulse from the target with the adaptive ultrasonic array and noting a time of the second peak return pulse; and (d) adjusting imaging of the target with the adaptive ultrasonic array with the time of the first peak return pulse and the time of the second peak return pulse.
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25. An ultrasonic system comprising:
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(a) a housing filled with a known ultrasound coupling fluid; b) an ultrasonic window mounted at a first end of the housing; c) a multi-element acoustic lens mounted within the housing and located to receive energy from the ultrasonic window; d) piezoelectric material; and e) an integrated circuit wherein the piezoelectric material and silicon integrated circuit are electrically connected by a bump bonding means for electrical connection, wherein the bump bonding means is constructed so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers. - View Dependent Claims (26, 27, 28)
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Specification