Semiconductor wafer clamp device and method

• US 5,733,426 A
• Filed: 05/23/1995
• Issued: 03/31/1998
• Est. Priority Date: 05/23/1995
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Bell, David G., Cox, Arthur L., Reinbold, Mark S.
• Primary Examiner(s): Breneman, R. Bruce
• Assistant Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US08/447,904
• Time in Patent Office: 1,043 Days
• Field of Search: 204/298.15, 118/728, 118/723 E, 118/500, 118/503, 156/345, 269/97, 269/254 R, 269/254 CS, 269/289 R, 269/317, 269/903
• US Class Current: 204/298.01
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems

Abstract

Semiconductor wafer clamp device includes at least one clamp apparatus, the clamp apparatus including a removable clamp finger coupled to a connecting block by a connector. The device allows access to clamp apparatus from a top surface of a substrate holder, eliminating the need to remove the substrate holder in order to perform maintenance or repair operations on clamp apparatus. Tempered springs in the clamp apparatus reduce resilience losses experienced with non-tempered springs. Plastic clamp shaft bushings and spring retainers extend the useful life of clamp apparatus components by eliminating wear caused by metal-to-metal contact of moving parts.

Claims

1. A semiconductor wafer clamp apparatus, comprising:

a removable clamp finger adapted to clamp a semiconductor wafer during use;

a connecting block comprising a clamp finger opening, a clamp shaft opening, a finger connector opening, and a shaft connector opening, the clamp finger opening being sized to receive a portion of the removable clamp finger;

an adjustable finger connector sized to fit within the connector opening and adapted to couple the removable clamp finger to the connecting block during use;

a clamp conduit comprising a top end having a flange disposed thereon to attach the clamp conduit to the connecting block, thereby forming a removable engagement between the clamp conduit and the connecting block to allow the clamp conduit to be accessed through the top end during use;

a clamp shaft adapted to move longitudinally within the clamp conduit during use; and

an adjustable shaft connector adapted to couple the clamp shaft to the connecting block during use, the adjustable shaft connector being sized to fit within the shaft connector opening.

2. A semiconductor wafer clamp apparatus, comprising:

a removable clamp finger adapted to clamp a semiconductor wafer during use;

a connecting block comprising a clamp finger opening, a clamp shaft opening, a finger connector opening, and a shaft connector opening, the clamp finger opening being sized to receive a portion of the removable clamp finger;

an adjustable finger connector adapted to couple the removable clamp finger to the connecting block during use, the adjustable finger connector being sized to fit within the finger connector opening;

a clamp conduit having a connecting member at one end, the connecting member being adapted to be attached to the connecting block;

a clamp shaft adapted to move longitudinally within the clamp conduit during use; and

an adjustable shaft connector adapted to couple the clamp shaft to the connecting block during use, the adjustable shaft connector being sized to fit within the shaft connector opening.

3. The semiconductor wafer clamp apparatus of claim 2, further comprising a resilient member adapted to be coupled to the clamp conduit, and adapted to apply force to the clamp shaft during use.

4. The semiconductor wafer clamp apparatus of claim 3 wherein the resilient member comprises a tempered spring.

5. The semiconductor wafer clamp apparatus of claim 2, further comprising a clamp shaft bushing comprising plastic, the clamp shaft bushing adapted to fit within the clamp conduit such that the clamp shaft moves within an inner opening of the clamp shaft bushing during use.

6. The semiconductor wafer clamp apparatus of claim 3, further comprising a resilient member retainer comprising plastic, the resilient member retainer being coupled to the clamp shaft and adapted to retain the resilient member within the clamp conduit during use.

7. A semiconductor wafer clamp device, comprising:

a substrate holder with a first face opposite a second face; and

a semiconductor wafer clamp apparatus, comprising;

a removable clamp finger adapted to clamp a semiconductor wafer during use;

a connecting block comprising a clamp finger opening, a clamp shaft opening, a finger connector opening, and a shaft connector opening, the clamp finger opening being sized to receive a portion of the removable clamp finger;

an adjustable finger connector adapted to couple the removable clamp finger to the connecting block during use, the adjustable finger connector being sized to fit within the finger connector opening;

a clamp conduit having a connecting member at one end adapted to be attached to the connecting block;

a clamp shaft adapted to move longitudinally within the clamp conduit during use;

an adjustable shaft connector adapted to couple the clamp shaft to the connecting block during use, the adjustable shaft connector being sized to fit within the shaft connector opening; and

a clamp shaft bushing comprising an inner opening, the clamp shaft bushing being positionable within the clamp conduit such that the clamp shaft moves within an inner opening of the clamp shaft bushing during use;

and wherein the first face of the substrate holder is adapted to receive a substrate, and wherein the second face of the substrate holder is adapted to receive the semiconductor wafer clamp apparatus.

8. The semiconductor wafer clamp device of claim 7, wherein the semiconductor wafer clamp apparatus further comprises a resilient member adapted to be coupled to the clamp conduit and adapted to apply force to the clamp shaft during use.

9. The semiconductor wafer clamp device of claim 8, wherein the semiconductor wafer clamp apparatus further comprises

a resilient member retainer comprising plastic, the resilient member retainer being coupled to the clamp shaft and adapted to retain the resilient member within the clamp conduit during use.

19. The semiconductor wafer clamp device of claim 8, wherein the resilient member comprises a tempered spring.

10. A semiconductor wafer clamp apparatus, comprising:

a clamp member, comprising;

a body; and

at least two projecting members extending outwardly from the body, wherein each of the projecting members is adapted to clamp a semiconductor wafer during use;

a clamp conduit having a connecting member at one end adapted to engage the body of the clamp member;

a clamp shaft adapted to move longitudinally within the clamp conduit during use; and

an adjustable clamp member connector adapted to couple the clamp member to the clamp shaft during use.

11. The semiconductor wafer clamp apparatus of claim 10, wherein at least one of the projecting members extend outwardly from the body at an angle of greater than 0 degrees and less than about 22 degrees.

12. The semiconductor wafer clamp apparatus of claim 10, further comprising:

a clamp shaft bushing adapted to fit within the clamp conduit such that the clamp shaft moves within an inner opening of the clamp shaft bushing during use.

13. The semiconductor wafer clamp apparatus of claim 10, further comprising a resilient member coupled to the clamp conduit and adapted to apply force to the clamp shaft during use.

14. The semiconductor wafer clamp apparatus of claim 13, wherein the resilient member comprises a tempered spring.

15. The semiconductor wafer clamp apparatus of claim 10, further comprising a clamp shaft bushing comprising plastic, the clamp shaft bushing adapted to fit within the clamp conduit such that the clamp shaft moves within an inner opening of the clamp shaft bushing during use.

16. The semiconductor wafer clamp apparatus of claim 13, further comprising a resilient member retainer comprising plastic, the resilient member retainer being coupled to the clamp shaft and adapted to retain the resilient member within the clamp conduit during use.

17. The semiconductor wafer clamp apparatus of claim 12 wherein the clamp shaft bushing comprises plastic, and further comprising:

a resilient member coupled to the clamp conduit and adapted to apply force to the clamp shaft during use; and

a resilient member retainer comprising plastic, the resilient member retainer being coupled to the clamp shaft and adapted to retain the resilient member within the clamp conduit during use.

18. A semiconductor wafer clamp device, comprising:

a substrate holder with a first face opposite a second face; and

a semiconductor wafer clamp apparatus, comprising;

a clamp member, comprising;

a body; and

at least two projecting members extending outwardly from the body, wherein each of the projecting members is adapted to clamp a semiconductor wafer during use;

a clamp conduit having a connecting member at one end;

a clamp shaft adapted to move longitudinally within the clamp conduit during use;

an adjustable clamp member connector adapted to couple the clamp member to the clamp shaft during use; and

a clamp shaft bushing comprising plastic, the clamp shaft bushing adapted to fit within the clamp conduit such that the clamp shaft moves within an inner opening of the clamp shaft bushing during use;

wherein the first face of the substrate holder is adapted to receive a substrate, and wherein the second face of the substrate holder is adapted to receive the semiconductor wafer clamp apparatus.

20. The semiconductor wafer clamp device of claim 18, wherein the semiconductor wafer clamp apparatus further comprises a resilient member coupled to the clamp conduit and adapted to apply force to the clamp shaft during use.

21. The semiconductor wafer clamp device of claim 20, wherein the resilient member comprises a tempered spring.

22. The semiconductor wafer clamp device of claim 20, wherein the semiconductor wafer clamp apparatus further comprises a resilient member retainer comprising plastic, the resilient member retainer being coupled to the clamp shaft and adapted to retain the resilient member within the clamp conduit during use.