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Multilayer e-beam lithography on nonconducting substrates

  • US 5,733,708 A
  • Filed: 10/02/1995
  • Issued: 03/31/1998
  • Est. Priority Date: 10/02/1995
  • Status: Expired due to Term
First Claim
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1. A method of producing multiple patterns on a non-conductive substrate to form a patterned substrate, comprising:

  • patterning a surface of the non-conductive substrate with an e-beam, including affixing a first conductive layer of e-beam resist to the surface and patterning with an e-beam to produce a first patterned conductive layer defining patterned areas between the first patterned conductive layer;

    providing at least one fiduciary mark with the first patterned conductive layer;

    removing a portion of the non-conductive substrate from the patterned areas of the patterned substrate to form a first pattern on the non-conductive substrate;

    protecting the fiduciary mark to produce a protected portion over the fiduciary mark;

    removing the first conductive layer, wherein the fiduciary mark of the first conductive layer is protected from removal;

    detaching the protected portion from the first conductive layer to expose the fiduciary mark;

    affixing a second conductive layer to the first pattern on the non-conductive substrate;

    registering the non-conductive substrate for patterning utilizing the fiduciary mark;

    patterning the surface of the non-conductive substrate with an e-beam, including affixing a second conductive layer of e-beam resist to the surface and patterning with the e-beam to produce a second patterned conductive layer defining second patterned areas between the second patterned conductive layer;

    removing a second portion of the non-conductive substrate from the second patterned areas of the patterned substrate; and

    removing the second conductive layer.

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