Multilayer e-beam lithography on nonconducting substrates

• US 5,733,708 A
• Filed: 10/02/1995
• Issued: 03/31/1998
• Est. Priority Date: 10/02/1995
• Status: Expired due to Term

• Current Assignee: Litel Interconnect Incorporated
• Original Assignee: Litel Instruments Incorporated
• Inventors: Smith, Adlai H., Catanzaro, Brian
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US08/538,153
• Time in Patent Office: 911 Days
• Field of Search: 430/296, 430/942, 430/313, 430/22, 430/5, 250/492.3, 250/492.2
• US Class Current: 430/296
• CPC Class Codes: H01J 37/3045 Object or beam position registration
• CPC Class Codes: Y10S 430/143 Electron beam

Abstract

A technique is described which provides for directly placing multiple patterns on a nonconducting substrate using an electron beam. Prior to patterning, a conductive coating is applied to the nonconductive substrate. The patterns are generated by controlling the position and the speed of movement of the electron beam. Each pattern contains fiducials lying outside of the pattern'"'"'s active region. After a conductive layer has been exposed, the patterned regions are removed, typically through etching. A separate etch is used to etch the pattern into substrate. The unpatterned portions of the conductive coating are then removed and a new conductive coating is applied to the substrate, insuring that the fiducials are protected during the removal procedure so that they can be used to align subsequent patterns. This procedure is repeated as many times as necessary to form the desired number of patterns in the substrate. This procedure is directly applicable to the generation of computer-generated holograms, specifically diffractive optics. This technique can also be used to generate phase-shifted lithographic mask.

Claims

1. A method of producing multiple patterns on a non-conductive substrate to form a patterned substrate, comprising:

patterning a surface of the non-conductive substrate with an e-beam, including affixing a first conductive layer of e-beam resist to the surface and patterning with an e-beam to produce a first patterned conductive layer defining patterned areas between the first patterned conductive layer;

providing at least one fiduciary mark with the first patterned conductive layer;

removing a portion of the non-conductive substrate from the patterned areas of the patterned substrate to form a first pattern on the non-conductive substrate;

protecting the fiduciary mark to produce a protected portion over the fiduciary mark;

removing the first conductive layer, wherein the fiduciary mark of the first conductive layer is protected from removal;

detaching the protected portion from the first conductive layer to expose the fiduciary mark;

affixing a second conductive layer to the first pattern on the non-conductive substrate;

registering the non-conductive substrate for patterning utilizing the fiduciary mark;

patterning the surface of the non-conductive substrate with an e-beam, including affixing a second conductive layer of e-beam resist to the surface and patterning with the e-beam to produce a second patterned conductive layer defining second patterned areas between the second patterned conductive layer;

removing a second portion of the non-conductive substrate from the second patterned areas of the patterned substrate; and

removing the second conductive layer.

2. The method of claim 1, wherein the protected portion of the first conductive layer includes a piece of tape applied to an area of the first conductive layer surrounding and including the fiduciary mark.

3. The method of claim 1, wherein the e-beam is controlled by a computer.

4. The method of claim 1, wherein at least three fiduciary marks are provided on the non-conductive substrate, the fiduciary marks lying outside the first patterned conductive area.

5. The method of claim 1, wherein the first conductive layer is formed of a first material and the second conductive layer is formed of a second material.

6. The method of claim 5, wherein the first material and the second material have the same composition.

7. The method of claim 1, wherein the first conductive layer and the second conductive layer are selected from the group consisting of metals and metal oxides.

8. The method of claim 1, wherein at least one of the removing steps uses an etching technique.

9. The method of claim 1, further comprising the steps of:

determining if the first patterned conductive layer meets a predetermined quality level prior to removing the portion of the non-conductive substrate from the patterned areas of the patterned substrate, and, if the first patterned conductive layer does not meet the predetermined quality level, then;

removing the first patterned conductive layer;

patterning a surface of the non-conductive substrate with an e-beam, including affixing a third conductive layer of e-beam resist to the surface and patterning with an e-beam to produce a third patterned conductive layer defining patterned areas between the third patterned conductive layer; and

,

removing the third conductive layer from the patterned areas of the patterned conductive layer.

10. The method of claim 9, further comprising the steps of:

determining if the patterned second conductive layer meets a predetermined quality level prior to removing the second portion of the non-conductive substrate from the second patterned areas of the patterned substrate, and, if the patterned second conductive layer does not meet the predetermined quality level, then;

removing the second conductive layer;

patterning a surface of the non-conductive substrate with an e-beam, including affixing a fourth conductive layer of e-beam resist to the surface and

patterning with an e-beam to produce a fourth patterned conductive layer defining patterned areas between the fourth patterned conductive layer; and

,

removing the fourth conductive layer from the patterned areas.