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Advanced parallel array processor computer package

  • US 5,734,921 A
  • Filed: 09/30/1996
  • Issued: 03/31/1998
  • Est. Priority Date: 11/13/1990
  • Status: Expired due to Fees
First Claim
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1. A computer package, comprising:

  • a semiconductor substrate and a housing, a plurality of multi-processor memory elements within said housing on said substrate, said housing configured in a quadflatpack with connections to the housing being provided at all four sides, each substrate containing eight or more processor memory elements, each processor memory element performing a portion of network routing functions, and providing parallel point-to-point connection to adjacent computer packages at each of the four sides of the housing;

    wherein said comnputer package provides a multi-processor memory system including a PME architecture multi-processor memory element on a single semiconductor substrate which functions as a system node, said multi-processor memory element including a plurality of processor memory elements, each of said processor memory elements having a processor coupled with a dedicated local memory, and means on said substrate for distributing interconnection and controls within the multi-processor memory system node enabling the system to perform SIMD/MIMD functions as a multi-processor memory system, wherein each dedicated local memory is independently accessible by the respectively coupled processor in both SIMD and MIMD modes exclusive of access by another processor.

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