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Polishing pad contour indicator for mechanical or chemical-mechanical planarization

  • US 5,736,427 A
  • Filed: 10/08/1996
  • Issued: 04/07/1998
  • Est. Priority Date: 10/08/1996
  • Status: Expired due to Term
First Claim
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1. A polishing pad for planarizing a surface of a substrate, comprising:

  • a polishing body having a planarizing surface facing the substrate; and

    a contour indicator embedded in the polishing body and extending across at least a portion of the polishing body, the contour indicator being visually distinguishable from the polishing body, and the contour indicator having first and second sidewalls spaced apart from one another within the polishing body to define a cross-sectional shape in which a width between the first and second sidewalls changes with respect to the depth of the pad, wherein the planarizing surface changes as the pad is conditioned and the width between the sidewalls at the planarizing surface indicates a contour of the planarizing surface of the polishing pad.

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