Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography
First Claim
1. An adaptive method for making an optical coupling to an electro-optical device on a substrate and electrically connected in a high density interconnect structure including at least one layer of polymer dielectric material bonded to a major surface of the electro-optical device and a metallization layer over the layer of polymer dielectric electrically connected through a via in the polymer dielectric layer to a contact pad on the electro-optical device, said device being situated within predetermined tolerances from an ideal position and orientation on the substrate, the method comprising the steps of:
- determining the actual position and orientation of the device on the substrate; and
adaptively forming an optical waveguide optically coupled to the device, the optical waveguide being formed along a route adapted as required for a proper optical coupling to the device in its actual position and orientation.
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Accused Products
Abstract
HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.
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Citations
8 Claims
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1. An adaptive method for making an optical coupling to an electro-optical device on a substrate and electrically connected in a high density interconnect structure including at least one layer of polymer dielectric material bonded to a major surface of the electro-optical device and a metallization layer over the layer of polymer dielectric electrically connected through a via in the polymer dielectric layer to a contact pad on the electro-optical device, said device being situated within predetermined tolerances from an ideal position and orientation on the substrate, the method comprising the steps of:
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determining the actual position and orientation of the device on the substrate; and adaptively forming an optical waveguide optically coupled to the device, the optical waveguide being formed along a route adapted as required for a proper optical coupling to the device in its actual position and orientation. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An adaptive method for integrating an electro-optical device within a high density interconnect electronic module, said method comprising the steps of:
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providing a high density interconnect module including a substrate containing at least one cavity, said module further including a plurality of integrated circuit chips disposed in the cavity such that major surfaces of the chips are substantially coplanar with portions of the substrate surrounding the cavity, and a multilayer interconnect structure including interleaved layers of dielectric material and conductive material disposed over the integrated circuit chips and the substrate for establishing electrical interconnections; removing a portion of the multilayer interconnect structure to form a cavity opening therein; placing an electro-optical device within the cavity opening and positioning said device within predetermined tolerances from an ideal position and orientation; determining the actual position and orientation of the electro-optical device; and adaptively forming an optical waveguide optically coupled to the electro-optical device, said optical waveguide being formed along a route adapted as required for proper optical coupling to the electro-optical device in its actual position and orientation, said optical waveguide being formed by at least partially embedding the device in a layer of optical waveguide material, and removing portions of the layer of optical waveguide material to leave the optical waveguide. - View Dependent Claims (8)
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Specification