Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography

• US 5,737,458 A
• Filed: 03/22/1995
• Issued: 04/07/1998
• Est. Priority Date: 03/29/1993
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Martin Marietta Corporation
• Inventors: Henkes, John Lawrence, Wojnarowski, Robert John, Cole, Herbert Stanley
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): KIM, ELLEN E
• Application Number:
  US08/408,236
• Time in Patent Office: 1,112 Days
• Field of Search: 385/129.14, 385/130.49, 385/50, 385/52, 385/15
• US Class Current: 385/15
• CPC Class Codes: B29D 11/00701 having an intermediate layer between core and cladding
• CPC Class Codes: G02B 2006/12173 Masking
• CPC Class Codes: G02B 2006/12176 Etching
• CPC Class Codes: G02B 6/1221 made from organic materials
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/421 the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device

Abstract

HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Claims

1. An adaptive method for making an optical coupling to an electro-optical device on a substrate and electrically connected in a high density interconnect structure including at least one layer of polymer dielectric material bonded to a major surface of the electro-optical device and a metallization layer over the layer of polymer dielectric electrically connected through a via in the polymer dielectric layer to a contact pad on the electro-optical device, said device being situated within predetermined tolerances from an ideal position and orientation on the substrate, the method comprising the steps of:

determining the actual position and orientation of the device on the substrate; and

adaptively forming an optical waveguide optically coupled to the device, the optical waveguide being formed along a route adapted as required for a proper optical coupling to the device in its actual position and orientation.

2. The adaptive method in accordance with claim 1, wherein the step of adaptively forming an optical waveguide comprises the further steps of:

at least partially embedding the device in a layer of optical waveguide material; and

removing portions of the layer of optical waveguide material to leave the optical waveguide.

3. The adaptive method in accordance with claim 2, wherein the step of removing portions comprises laser-ablating the portions.

4. The method in accordance with claim 1, wherein the step of adaptively forming an optical waveguide also comprises the step of forming the waveguide with proper optical coupling to an external waveguide in its actual position and orientation.

5. The adaptive method in accordance with claim 1, wherein the step of adaptively forming an optical waveguide further comprises forming the waveguide with proper optical coupling to a second device in its actual position and orientation, the second device being situated on the substrate.

6. The adaptive method in accordance with claim 1, wherein the step of adaptively forming an optical waveguide further comprises forming the waveguide with proper optical coupling to a base waveguide, said base waveguide being situated on substrate at a predetermined location and with a predetermined orientation.

7. An adaptive method for integrating an electro-optical device within a high density interconnect electronic module, said method comprising the steps of:

providing a high density interconnect module including a substrate containing at least one cavity, said module further including a plurality of integrated circuit chips disposed in the cavity such that major surfaces of the chips are substantially coplanar with portions of the substrate surrounding the cavity, and a multilayer interconnect structure including interleaved layers of dielectric material and conductive material disposed over the integrated circuit chips and the substrate for establishing electrical interconnections;

removing a portion of the multilayer interconnect structure to form a cavity opening therein;

placing an electro-optical device within the cavity opening and positioning said device within predetermined tolerances from an ideal position and orientation;

determining the actual position and orientation of the electro-optical device; and

adaptively forming an optical waveguide optically coupled to the electro-optical device, said optical waveguide being formed along a route adapted as required for proper optical coupling to the electro-optical device in its actual position and orientation, said optical waveguide being formed by at least partially embedding the device in a layer of optical waveguide material, and removing portions of the layer of optical waveguide material to leave the optical waveguide.

8. An adaptive method in accordance with claim 7, wherein the step of removing portions comprises laser-ablating said portions.