Substrate chamfering machine

• US 5,738,563 A
• Filed: 11/07/1996
• Issued: 04/14/1998
• Est. Priority Date: 03/07/1995
• Status: Expired due to Fees

• Current Assignee: KAO Corporation
• Original Assignee: KAO Corporation
• Inventors: Shibata, Manabu
• Primary Examiner(s): Rose, Robert A.
• Assistant Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US08/737,139
• Time in Patent Office: 523 Days
• Field of Search: 457/5, 457/43, 457/44, 457/254-256, 457/63, 457/6
• US Class Current: 451/5
• CPC Class Codes: B23Q 15/02 according to the instantaneous size and the required size of the workpiece acted upon B23Q15/06 takes precedence
• CPC Class Codes: B24B 9/065 of thin, brittle parts, e.g. semiconductors, wafers
• CPC Class Codes: G05B 2219/45162 Chamfer grinding

Abstract

A substrate inner/outer edge chamfering machine set for chamfering the outer and inner edges of substrates is shown, and includes inner and outer chamfering machines 11 with grinding wheels for chamfering the inner and outer edges, respectively, of each substrate. A measuring unit 12 successively measures the chamfer length of substrates worked by the inner and outer chamfering machines, and a measurement data processing unit 13 calculates the correction amount with respect to a grinding wheel feed amount according to measurement results from the measuring unit. A control unit 14 controls the operation of the inner and outer edge chamfering machines and corrects the grinding wheel feed amount according to the correction amount from the measurement data processing unit.

Claims

1. A substrate chamfering machine for forming chamfers in a substrate edge comprising:

a chamfering machine including a grinding wheel for chamfering the substrate edge;

a measuring unit for successively measuring a chamfer length of substrates worked by the chamfering machine;

a measurement data processing unit for calculating a correction amount with respect to a feed amount of the grinding wheel according to the measuring result of the measuring unit; and

a control unit for controlling the operation of the chamfering machine and correcting the feed amount of the grinding wheel according to the correction amount calculated by the measurement data processing unit.

2. The substrate chamfering machine according to claim 1, wherein the measuring unit measures the chamfer length from the side of the front or back surface of the substrate.

3. The substrate chamfering machine according to claim 1, wherein the measuring unit includes a camera for picking up the chamfer length of the substrate and an image processing unit for digitally converting an image picked up by the camera and processing the resultant digital data to determine the chamfer length.

4. The substrate chamfering machine according to claim 1, wherein the measurement data processing unit judges whether the measured chamfer length is adequate and, if inadequate, outputs a discarding signal, and the control unit controls the chamfering machine according to the discarding signal to cause any inadequate chamfer length substrate to be discarded to the outside of the machine.

5. The substrate chamfering machine according to claim 1, wherein the substrate is made of a non-metallic material.

6. The substrate chamfering machine according to claim 5, wherein the substrate is made of a glass like carbon material.

7. The substrate chamfering machine according to claim 2, wherein the measuring unit includes a camera for picking up the chamfer length of the substrate and an image processing unit for digitally converting an image picked up by the camera and processing the resultant digital data to determine the chamfer length.

8. The substrate chamfering machine according to claim 2, wherein the measurement data processing unit judges whether the measured chamfer length is adequate and, if inadequate, outputs a discarding signal, and the control units controls the chamfering machine according to the discarding signal to cause any inadequate chamfer length substrate to be discarded to the outside of the machine.

9. The substrate chamfering machine according to claim 3, wherein the measurement data processing unit judges whether the measured chamfer length is adequate and, if inadequate, outputs a discarding signal, and the control units controls the chamfering machine according to the discarding signal to cause any inadequate chamfer length substrate to be discarded to the outside of the machine.

10. The substrate chamfering machine according to claim 2, wherein the substrate is made of a non-metallic material.

11. The substrate chamfering machine according to claim 3, wherein the substrate is made of a non-metallic material.

12. The substrate chamfering machine according to claim 4, wherein the substrate is made of a non-metallic material.