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Flexible tilted wafer carrier

  • US 5,738,568 A
  • Filed: 10/04/1996
  • Issued: 04/14/1998
  • Est. Priority Date: 10/04/1996
  • Status: Expired due to Fees
First Claim
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1. A polishing apparatus for polishing a surface of a workpiece comprising:

  • a carrier assembly which is pivotally mounted to a rotation shaft; and

    tilting means for setting a polishing angle on the carrier assembly by applying pressure to a predetermined point on said carrier assembly, said tilting means being rotationally positionable 360 degrees around said rotation shaft.

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