Flexible tilted wafer carrier

• US 5,738,568 A
• Filed: 10/04/1996
• Issued: 04/14/1998
• Est. Priority Date: 10/04/1996
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Jurjevic, Robert A., Miller, Matthew K., Lebel, Richard J.
• Primary Examiner(s): Morgan, Eileen P.
• Application Number:
  US08/726,103
• Time in Patent Office: 557 Days
• Field of Search: 451/41, 451/285, 451/287, 451/288, 451/398, 451/405, 451/387
• US Class Current: 451/41
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces

Abstract

Disclosed is an improved apparatus and method for polishing a semiconductor wafer, which involves mounting the wafer to a carrier assembly. The wafer carrier assembly has been split into two plates which are joined by springs around the peripheries. The wafer carrier assembly is universally mounted on a rotation shaft which rotates the wafer carrier assembly during cleaning. An adjustment screw tilts the upper plate relative to the lower plate. The adjustment screw can be located at any predetermined point on a circle around the rotation shaft. Since the bottom plate is forced relatively flat by contact with a polishing pad, the net effect of the wafer carrier assembly is to apply increased pressure to the wafer edge under the screw. This provides for an even polishing action to compensate for otherwise non-uniform radial polishing action on the wafer surface.

Claims

1. A polishing apparatus for polishing a surface of a workpiece comprising:

a carrier assembly which is pivotally mounted to a rotation shaft; and

tilting means for setting a polishing angle on the carrier assembly by applying pressure to a predetermined point on said carrier assembly, said tilting means being rotationally positionable 360 degrees around said rotation shaft.

2. The polishing apparatus according to claim 1, wherein the tilting means limits the upward movement of an edge of the carrier assembly.

3. The polishing apparatus according to claim 1, wherein the tilting means is coupled to a bearing which surrounds the rotation shaft.

4. The polishing apparatus according to claim 1, wherein the tilting means includes an adjustment screw.

5. The polishing apparatus according to claim 4, wherein the adjustment screw has a swivel wheel attached thereto.

6. The polishing apparatus according to claim 1, wherein the carrier assembly includes a first lower plate;

and

a second upper plate which are connected with vibration dampening devices.

7. The polishing apparatus according to claim 6, wherein the vibration dampening devices comprise a plurality of springs.

8. The polishing apparatus according to claim 4, wherein the adjustment screw is a hand screw.

9. The polishing apparatus according to claim 1, wherein the tilting means is controlled by a pressure gauge.

10. The polishing apparatus according to claim 1, wherein the tilting means is controlled by a feedback loop.

11. A polishing apparatus for polishing a surface of a workpiece comprising:

a carrier assembly including a first plate, said first plate having a lower surface wherein said workpiece may be held, and a second plate positioned above said first plate;

a rotatable shaft wherein said second plate is pivotally mounted thereto;

a vibration dampening system interconnecting an upper surface of said first plate to a lower surface of said second plate; and

means for tilting said second plate relative to the first plate, wherein said titling means is rotationally mounted to said rotatable shaft.

12. The polishing apparatus according to claim 11, wherein said vibration dampening system comprises a plurality of springs.

13. The polishing apparatus according to claim 11, wherein the tilting means includes an adjustment screw.

14. The polishing apparatus according to claim 11, wherein the workpiece is a semiconductor wafer.

15. The polishing apparatus according to claim 12, wherein said plurality of springs are located peripherally on the first and second plates.

16. The polishing apparatus according to claim 13, wherein the adjustment screw is a hand screw.

17. The polishing apparatus according to claim 11, wherein the tilting means is controlled by a pressure gauge.

18. The polishing apparatus according to claim 11, wherein the tilting means is controlled by a feedback loop.

19. The polishing apparatus according to claim 11, and further comprising a bearing which surrounds the rotatable shaft and which is coupled around the adjustment screw.

20. The polishing apparatus according to claim 13, and further comprising a swivel wheel attached to the adjustment screw.

21. A method of polishing a surface of a workpiece with a polishing apparatus having a carrier assembly, a device for tilting said carrier assembly, and a rotation shaft, wherein said carrier assembly is pivotally mounted to said rotation shaft, and said tilting device is rotationally positionable around said rotation shaft, said method comprising the steps of:

a) mounting said workpiece on a lower surface of said carrier assembly;

b) positioning said tilting device at a predetermined position on a top surface of the carrier assembly;

c) adjusting said tilting device to create a predetermined angle of attack of the carrier assembly; and

d) rotatably contacting the workpiece with a rotating polishing pad to effect a polishing action across the workpiece.

22. The method of claim 21, wherein said tilting device includes an adjustment screw.

23. The method of claim 21, wherein said carrier assembly comprises a lower first plate which is interconnected with an upper second plate through a vibration dampening system.