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Method and apparatus for detecting optimal endpoints in plasma etch processes

  • US 5,738,756 A
  • Filed: 06/30/1995
  • Issued: 04/14/1998
  • Est. Priority Date: 06/30/1995
  • Status: Expired due to Term
First Claim
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1. A method of detecting an endpoint for terminating a chemical process involving one or more chemical species, the process taking place in a chamber, said method comprising the steps of:

  • defining the endpoint in the form of a mode, a minimum value of a delay count and a threshold;

    initiating the chemical process;

    detecting intensity of light emitted during the chemical process by one or more of the one or more species in the form of an analog signal representing the intensity of each of the detected species;

    sampling each analog signal at a rate and at the beginning of a current sampling period defined by the rate to produce a set of raw data samples for the current sampling period;

    pre-filtering each of the set of raw data samples of the current sampling period;

    normalizing each of the set of pre-filtered data samples;

    auto-correlating the set of normalized data samples to produce a multichannel value for the current sampling period;

    post-filtering the multichannel value;

    incrementing the delay count when the threshold has been exceeded by the post-filtered multichannel value and the mode is met, otherwise setting the delay count equal to zero; and

    repeating said pre-filtering, normalizing, auto-correlating, post-filtering, and incrementing steps for each set of raw data samples until the delay count reaches or exceeds the minimum value; and

    terminating the process when the delay count reaches or exceeds the minimum value.

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