Substrate handling and processing system for flat panel displays

• US 5,738,767 A
• Filed: 11/23/1994
• Issued: 04/14/1998
• Est. Priority Date: 01/11/1994
• Status: Expired due to Term

• Current Assignee: Intevac
• Original Assignee: Intevac
• Inventors: Coad, George L., Hughes, John Lester, Lawson, Eric C.
• Primary Examiner(s): NGUYEN, NAM X
• Application Number:
  US08/342,275
• Time in Patent Office: 1,238 Days
• Field of Search: 204/192.12, 204/192.32, 204/298.25, 204/298.26, 204/298.28, 204/298.35, 118/719, 118/729, 118/730, 414/217, 414/222
• US Class Current: 204/192.12
• CPC Class Codes: C03C 17/002 for flat glass, e.g. float glass
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/56 Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
• CPC Class Codes: C23C 14/566 using a load-lock chamber

Abstract

A vacuum processing system for handling and processing rectangular glass panels for flat panel displays has a cluster configuration. The system includes a central buffer chamber, with multiple processing chambers, a load lock and an unload lock positioned around the buffer chamber and coupled to the buffer chamber through gate valves. The buffer chamber contains a turntable that is rotatable about a vertical axis. The system further includes substrate carriers, each for supporting a substrate in a vertical orientation as it is transported through the system and is processed. The turntable has dual substrate carrier positions for rotating substrate carriers into alignment with a selected processing chamber, the load lock or the unload lock. Multiple substrates can be handled and processed concurrently to achieve a high throughput rate. The system is typically used for sputter deposition of ITO films and metal films on the glass substrate.

Claims

1. A vacuum processing system comprising:

a load lock for loading substrates into the system;

a plurality of processing chambers for processing said substrates;

an unload lock for unloading said substrates from the system;

a central buffer chamber coupled to said load lock, to each of said processing chambers and to said unload lock through gate valves, said buffer chamber containing a turntable that is rotatable about a vertical axis;

means for vacuum pumping said load lock, said processing chambers, said unload lock and said central buffer chamber;

rotation means for rotating said turntable about said vertical axis;

two or more substrate carriers, each of which supports a substrate in a vertical orientation as it is transported within the system and each of which supports the substrate in a vertical orientation within a selected one of said processing chambers independently of said turntable and said buffer chamber as the substrate is processed;

transport means for transporting said substrate carriers horizontally to and between said load lock and said turntable, to and between said turntable and said selected one of said processing chambers, and to and between said turntable and said unload lock; and

control means for controlling said rotation means and said transport means such that each of said substrate carriers follows a selected path through said system, whereby two or more substrates can be transported through the system and processed concurrently and independently.

2. A vacuum processing system as defined in claim 1 wherein said turntable includes first and second substrate carrier positions, each spaced from the vertical axis of said turntable by a distance D and wherein said transport means includes means for moving said substrate carriers between said load lock and said substrate carrier positions on said turntable.

3. A vacuum processing system as defined in claim 2 wherein said transport means further includes means for moving said substrate carriers between said first and second substrate carrier positions on said turntable, and said processing chambers.

4. A vacuum processing system as defined in claim 3 wherein said transport means further includes means for moving said substrate carriers between said first and second substrate carrier positions on said turntable, and said unload lock.

5. A vacuum processing system as defined in claim 4 wherein said processing chambers are grouped in pairs around said buffer chamber and wherein each of said processing chambers has a substrate processing position that falls on a straight line spaced from the vertical axis of rotation of said turntable by said distance D.

6. A vacuum processing system as defined in claim 1 wherein said load lock includes a door having a substrate holder and wherein said load lock further includes means for transferring said substrate from said substrate holder to one of said substrate carriers after said door has been closed and said load lock has been evacuated, such that said substrate carriers remain at high vacuum at all times during operation of the system.

7. A vacuum processing system as defined in claim 6 wherein said control means includes means for enabling said transport means to transport said one of said substrate carriers into said load lock for receiving said substrate only when said load lock is evacuated.

8. A vacuum processing system as defined in claim 1 wherein said unload lock includes a door having a substrate holder and wherein said unload lock further includes means for transferring said substrate from one of said substrate carriers to said substrate holder before said unload lock is vented, such that said substrate carriers remain at high vacuum at all times during operation of the system.

9. A vacuum processing system as defined in claim 8 wherein said control means includes means for enabling said transport means to transport said one of said substrate carriers from said unload lock to said buffer chamber before said unload lock is vented for removal of said substrate.

10. A vacuum processing system as defined in claim 1 wherein each of said substrate carriers includes means for holding a rectangular glass substrate in a vertical orientation with its edges at about 45°

with respect to horizontal.

11. A vacuum processing system as defined in claim 1 wherein six of said processing chambers are disposed around said buffer chamber and wherein six of said substrate carriers are used for transporting substrates within said system.

12. A vacuum processing system as defined in claim 11 wherein said processing chambers include one or more sputtering chambers and one or more preheating chambers.

13. A vacuum processing system as defined in claim 1 wherein said transport means includes a plurality of rollers and means for rotating said rollers.

14. A vacuum processing system as defined in claim 13 wherein said rollers are located below said substrate to inhibit particulate contamination of said substrate.

15. A vacuum processing system as defined in claim 1 wherein said turntable includes first and second substrate carrier positions equally spaced from the vertical axis of rotation of said turntable by a distance D.

16. A vacuum processing system as defined in claim 15 wherein each of said processing chambers has a substrate processing position located along a straight line spaced from the vertical axis of rotation of said turntable by said distance D, such that said substrate carriers can be moved along said straight line between the first and second substrate carrier positions on said turntable and said substrate processing position.

17. A vacuum processing system as defined in claim 1 wherein each of said substrate carriers comprises a plate having first and second upper edges which intersect at a right angle, said first and second upper edges each having a groove for receiving said substrate.

18. A vacuum processing system as defined in claim 17 wherein said transport means comprises a plurality of rollers on which said plate rests and means for rotating said rollers to transport said plate.

19. A vacuum processing system as defined in claim 18 wherein said transport means further includes guide wheels that abut against sides of said plate and maintain said plate in a vertical orientation as it is transported through said system.

20. A vacuum processing system as defined in claim 1 wherein said load lock and said unload lock each comprise:

an enclosure defining a lock chamber;

a carrier transport assembly for transporting a substrate carrier to and between said lock chamber and said central buffer chamber;

a door assembly including a door, a substrate support arm and a transfer mechanism for transferring a substrate to and between said support arm and said substrate carrier; and

a linear drive mechanism for linearly moving said door assembly between an open position for transfer of a substrate to or from said support arm and a closed position for transfer of said substrate to and between said support arm and said substrate carrier.

21. A vacuum processing system as defined in claim 20 wherein said transfer mechanism comprises a movable carriage having said substrate support arm rigidly attached thereto, a drive motor and a cam linkage coupled between said drive motor and said movable carriage for moving said carriage and said substrate support arm along a prescribed path.

22. A vacuum processing system as defined in claim 21 wherein said prescribed path includes a first segment wherein said support arm moves toward said substrate carrier, a second segment wherein said support arm moves vertically for raising or lowering said substrate and a third segment for moving said support arm away from said substrate carrier.

23. A method for handling substrates in a vacuum processing system comprising:

a) providing a vacuum processing system including a central buffer chamber, a load lock, an unload lock, two or more processing chambers disposed around said buffer chamber and coupled to said buffer chamber, and two or more substrate carriers for transporting substrates within said system, each of said substrate carriers supporting a substrate in a vertical orientation as it is transported within the system;

b) loading a substrate into the load lock and evacuating the load lock;

c) transferring the substrate to one of said substrate carriers;

d) transporting the substrate and the substrate carrier from the load lock onto a turntable in the buffer chamber;

e) rotating the turntable about a vertical axis of rotation into alignment with a selected processing chamber of said processing chambers;

f) transporting the substrate and the substrate carrier horizontally from the turntable into said selected processing chamber;

g) processing the substrate in said selected processing chamber with the substrate carrier supporting the substrate in a vertical orientation within the processing chamber independently of the turntable and the buffer chamber;

h) transporting the substrate and the substrate carrier horizontally from said selected processing chamber onto the turntable;

i) rotating the turntable into alignment with the unload lock;

j) transporting the substrate and the substrate carrier from the turntable into the unload lock;

k) transferring the substrate from the substrate carrier to the unload lock;

1) transporting the substrate carrier from the unload lock onto the turntable in the central buffer chamber;

m) venting the unload lock and removing the substrate from the unload lock; and

n) repeating steps b) through m) for two or more substrates in a time-multiplexed manner such that the two more substrates are processed concurrently by said system.

24. A method for handling substrates as defined in claim 23 further including repeating steps e) through h) for two or more processing chambers.

25. A method for handling substrates as defined in claim 24 further including the step of providing first and second substrate carrier positions on said turntable, said first and second substrate carrier positions being equally spaced from the vertical axis of rotation of said turntable by a distance D.