Substrate handling and processing system for flat panel displays
First Claim
1. A vacuum processing system comprising:
- a load lock for loading substrates into the system;
a plurality of processing chambers for processing said substrates;
an unload lock for unloading said substrates from the system;
a central buffer chamber coupled to said load lock, to each of said processing chambers and to said unload lock through gate valves, said buffer chamber containing a turntable that is rotatable about a vertical axis;
means for vacuum pumping said load lock, said processing chambers, said unload lock and said central buffer chamber;
rotation means for rotating said turntable about said vertical axis;
two or more substrate carriers, each of which supports a substrate in a vertical orientation as it is transported within the system and each of which supports the substrate in a vertical orientation within a selected one of said processing chambers independently of said turntable and said buffer chamber as the substrate is processed;
transport means for transporting said substrate carriers horizontally to and between said load lock and said turntable, to and between said turntable and said selected one of said processing chambers, and to and between said turntable and said unload lock; and
control means for controlling said rotation means and said transport means such that each of said substrate carriers follows a selected path through said system, whereby two or more substrates can be transported through the system and processed concurrently and independently.
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Accused Products
Abstract
A vacuum processing system for handling and processing rectangular glass panels for flat panel displays has a cluster configuration. The system includes a central buffer chamber, with multiple processing chambers, a load lock and an unload lock positioned around the buffer chamber and coupled to the buffer chamber through gate valves. The buffer chamber contains a turntable that is rotatable about a vertical axis. The system further includes substrate carriers, each for supporting a substrate in a vertical orientation as it is transported through the system and is processed. The turntable has dual substrate carrier positions for rotating substrate carriers into alignment with a selected processing chamber, the load lock or the unload lock. Multiple substrates can be handled and processed concurrently to achieve a high throughput rate. The system is typically used for sputter deposition of ITO films and metal films on the glass substrate.
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Citations
25 Claims
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1. A vacuum processing system comprising:
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a load lock for loading substrates into the system; a plurality of processing chambers for processing said substrates; an unload lock for unloading said substrates from the system; a central buffer chamber coupled to said load lock, to each of said processing chambers and to said unload lock through gate valves, said buffer chamber containing a turntable that is rotatable about a vertical axis; means for vacuum pumping said load lock, said processing chambers, said unload lock and said central buffer chamber; rotation means for rotating said turntable about said vertical axis; two or more substrate carriers, each of which supports a substrate in a vertical orientation as it is transported within the system and each of which supports the substrate in a vertical orientation within a selected one of said processing chambers independently of said turntable and said buffer chamber as the substrate is processed; transport means for transporting said substrate carriers horizontally to and between said load lock and said turntable, to and between said turntable and said selected one of said processing chambers, and to and between said turntable and said unload lock; and control means for controlling said rotation means and said transport means such that each of said substrate carriers follows a selected path through said system, whereby two or more substrates can be transported through the system and processed concurrently and independently. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for handling substrates in a vacuum processing system comprising:
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a) providing a vacuum processing system including a central buffer chamber, a load lock, an unload lock, two or more processing chambers disposed around said buffer chamber and coupled to said buffer chamber, and two or more substrate carriers for transporting substrates within said system, each of said substrate carriers supporting a substrate in a vertical orientation as it is transported within the system; b) loading a substrate into the load lock and evacuating the load lock; c) transferring the substrate to one of said substrate carriers; d) transporting the substrate and the substrate carrier from the load lock onto a turntable in the buffer chamber; e) rotating the turntable about a vertical axis of rotation into alignment with a selected processing chamber of said processing chambers; f) transporting the substrate and the substrate carrier horizontally from the turntable into said selected processing chamber; g) processing the substrate in said selected processing chamber with the substrate carrier supporting the substrate in a vertical orientation within the processing chamber independently of the turntable and the buffer chamber; h) transporting the substrate and the substrate carrier horizontally from said selected processing chamber onto the turntable; i) rotating the turntable into alignment with the unload lock; j) transporting the substrate and the substrate carrier from the turntable into the unload lock; k) transferring the substrate from the substrate carrier to the unload lock; 1) transporting the substrate carrier from the unload lock onto the turntable in the central buffer chamber; m) venting the unload lock and removing the substrate from the unload lock; and n) repeating steps b) through m) for two or more substrates in a time-multiplexed manner such that the two more substrates are processed concurrently by said system. - View Dependent Claims (24, 25)
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Specification